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Toshiba Field Effect Transistor Silicon N Channel MOS Type SSM3K02F Data Manual

Summary

A compact N-channel MOSFET transistor engineered for high-speed switching applications. Featuring low on-resistance and a small footprint, this component delivers reliable performance in dynamic circuits. The manual provides exhaustive technical specifications, including maximum ratings, operational curves, electrical characteristics, detailed handling precautions (ESD), and guidelines essential for designing robust electronic systems in general consumer or industrial equipment. Ideal for engineers building high-efficiency power switching solutions.

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查询SSM3K02F供应商

SSM3K02F

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type

SSM3K02F

High Speed Switching Applications

Unit: mm

Small package Low on resistance : Ron = 200 mΩ (max) (VGS = 4 V) : Ron = 250 mΩ (max) (VGS = 2.5 V) Low gate threshold voltage: Vth = 0.6~1.1 V (VDS = 3 V, ID = 0.1 m A)

Maximum Ratings (Ta  25°C)

Characteristics Symbol Rating Unit

Drain-source voltage VDS 30 V Gate-source voltage VGSS 10 V

DC ID 1.0

Drain current

Pulse IDP 2.0

Drain power dissipation PD 200 m W

Channel temperature Tch 150 °C JEDEC TO-236MOD

Storage temperature range Tstg 55~150 °C JEITA SC-59

TOSHIBA 2-3F1F

Weight: 0.012 g (typ.)

Marking Equivalent Circuit

Handling Precaution When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects that come into direct contact with devices should be made of anti-static materials.

Page Summary Contents For Toshiba Field Effect Transistor Silicon N Channel MOS Type SSM3K02F Data Manual

Page 1 查询SSM3K02F供应商 SSM3K02F TOSHIBA Field Effect Transistor Silicon N Channel MOS Type SSM3K02F High Speed Switching Applications Unit: mm Small package Low on resistance : Ron = 200 mΩ (max) (VGS = 4 V) :...
Page 2 SSM3K02F Electrical Characteristics (Ta  25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS  10 V, VDS  0   5 A Drain-source breakdown voltage V (BR) D...
Page 3 SSM3K02F
Page 4 SSM3K02F Figure 1 25.4 mm  25.4 mm  1.6 t (a Cu pad of 0.8 mm2 area)
Page 5 SSM3K02F 000707EAARESTRICTIONS ON PRODUCT USE TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or f...