Fairchild FDB52N20 Datasheet
Summary
The FDB52N20 is a high-performance 200V N-Channel MOSFET designed for demanding power electronics applications. Built with advanced DMOS technology, it provides extremely low on-state resistance and superior switching capabilities crucial for high-efficiency switched-mode power supplies (SMPS) and active power factor correction (PFC). This technical manual provides comprehensive reference specifications, including detailed electrical characteristics, thermal performance graphs, absolute maximum ratings, and reliable data necessary for engineers designing robust, high-power conversion systems.
Page 1 Text Content
52N 20 200V -C an el M
July 2008
Uni FETTM
FDB52N20 200V N-Channel MOSFET Features Description 52A, 200V, RDS(on) = 0.049Ω @VGS = 10 V These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
Low gate charge ( typical 49 n C)
DMOS technology.
Low Crss ( typical 66 p F)
This advanced technology has been especially tailored to mini-
Fast switching mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
100% avalanche tested
commutation mode. These devices are well suited for high effi-
Improved dv/dt capability cient switched mode power supplies and active power factor
correction.
Absolute Maximum Ratings Symbol Parameter FDB52N20 Unit VDSS Drain-Source Voltage
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM Drain Current - Pulsed (Note 1)
VGSS Gate-Source voltage ±30
EAS Single Pulsed Avalanche Energy (Note 2) m J
IAR Avalanche Current (Note 1)
EAR Repetitive Avalanche Energy (Note 1) 35.7 m J
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
PD Power Dissipation (TC = 25°C)
- Derate above 25°C 2.86 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TL Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
Thermal Characteristics Symbol Parameter Min. Max. Unit RθJC Thermal Resistance, Junction-to-Case 0.35 °C/W
RθJA* Thermal Resistance, Junction-to-Ambient* °C/W
RθJA Thermal Resistance, Junction-to-Ambient 62.5 °C/W
* When mounted on the minimum pad size recommended (PCB Mount)
©2 008 Fairchild Semiconductor Corporation www.fairchildsemi.com FD B52N20 Rev. A
Page Summary Contents For Fairchild FDB52N20 Datasheet
Manual Details
| Brand | Fairchild |
|---|---|
| Pages | 8 |
| File Size | 937.51 KB |
| Published | July 12, 2026 |
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