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Toshiba Field Effect Transistor Silicon N Channel MOS Type (High speed U- MOSIII) TPC8010-H Data Sheet

Summary

This high-speed N Channel MOS Field Effect Transistor is engineered for demanding power conversion applications, offering low drain-source resistance (Rds(ON)) and small gate charge while maintaining a compact footprint. Ideal for portable equipment and notebook PC designs that require efficient DC-DC conversion. This manual provides comprehensive technical specifications, including electrical and thermal characteristics ratings up to 30V/150°C, ensuring selection and proper application of the component in general electronic systems.

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查询TPC8010-H供应商

TPC8010-H

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (High speed U-MOSIII)

TPC8010-H

DC-DC Converters

Unit: mm

Notebook PC Applications Portable Equipment Applications

• Small footprint due to small and thin package • High speed switching • Small gate charge: Qg = 18 n C (typ.) • Low drain-source ON resistance: RDS (ON) = 12 mΩ (typ.) • High forward transfer admittance: |Yfs| = 11 S (typ.) • Low leakage current: IDSS = 10 µA (max) (VDS = 30 V) • Enhancement mode: Vth = 1.1 to 2.3 V (VDS = 10 V, ID = 1 m A)

Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Drain-source voltage VDSS 30 V Drain-gate voltage (RGS = 20 kΩ) VDGR 30 V

Gate-source voltage VGSS ±20 V JEDEC ―

DC (Note 1) ID 11 JEITA ―

Drain current

Pulse (Note 1) IDP 44

TOSHIBA 2-6J1B

Drain power dissipation (t = 10 s)

PD 1.9 W Weight: 0.080 g (typ.)

(Note 2a) Drain power dissipation (t = 10 s)

PD 1.0 W

(Note 2b)

Circuit Configuration

Single pulse avalanche energy

EAS 157 m J

(Note 3)

Avalanche current IAR 11 A Repetitive avalanche energy

EAR 0.19 m J

(Note 2a) (Note 4)

Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C

Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the

next page.

This transistor is an electrostatic sensitive device. Please handle with caution.

Page Summary Contents For Toshiba Field Effect Transistor Silicon N Channel MOS Type (High speed U- MOSIII) TPC8010-H Data Sheet

Page 1 查询TPC8010-H供应商 TPC8010-H TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (High speed U-MOSIII) TPC8010-H DC-DC Converters Unit: mm Notebook PC Applications Portable Equipment Applications •...
Page 2 TPC8010-H Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to ambient Rth (ch-a) 65.8 °C/W (t = 10 s) (Note 2a) Thermal resistance, channel to ambient Rth (ch-a) 125...
Page 3 TPC8010-H Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS = ±16 V, VDS = 0 V   ±10 µA Drain cut-OFF current IDSS VDS = 30...
Page 4 TPC8010-H Fo rw ar tra ns fe r a dm itt an ce |Y fs ra in ur re nt (A ra in ur re nt (A ID – VDS ID – VDS Common Common source source Ta = 25°C Ta = 25°C 5 2.8 Pulse test Pulse test VGS = 2.1 V VGS = ...
Page 5 TPC8010-H ra in -s ou rc on re si st an ce ra in ow er is si pa tio (W ap ac ita nc (p F) (O RDS (ON) – Ta IDR – VDS ID = 11, 5.5, 2.5 A VGS = 0 V VGS = 4.5 V ID = 11, 5.5, 2.5 A Common source Common ...
Page 6 TPC8010-H ra in ur re nt (A rth − tw (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy Tr an si en t t he rm al im pe da nc (° /W board (b) (Note 2b) t = 10 s...
Page 7 TPC8010-H 000707EAARESTRICTIONS ON PRODUCT USE • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction o...

Manual Details

Brand Toshiba
Pages 7
File Size 334.88 KB
Published May 31, 2026
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Frequently Asked Questions

What are the typical drain-source electrical specifications?

The low drain-source ON resistance (RDS(ON)) is typically 12 mΩ, and the high forward transfer admittance (|Y|) is typically 11 S.

What should be considered regarding device handling and safety?

This transistor is an electrostatic sensitive device and must be handled with caution. The buyer is responsible for complying with safety standards in system design to prevent injury or property damage.

What are the thermal dissipation limits under different conditions?

The drain power dissipation (t = 10s) can be 1.9 W on a glass-epoxy board (a) or 1.0 W on a glass-epoxy board (b).

Under what operating temperature range must the channel temperature remain below?

Note 1 specifies that devices must be used under conditions where the channel temperature is below 150°C.