TI Texas Instruments CD4001UB Data Sheet
Summary
This technical data sheet provides detailed mechanical and dimensional specifications for various semiconductor package types (e.g., SOIC, TSSOP). It serves as a critical resource for electrical engineers, device designers, and procurement professionals who require precise information on component packaging materials, dimensions, pin layouts, and mounting details when integrating components into printed circuit boards. The document ensures adherence to industry standards necessary for reliable product design and manufacturing.
Page 1 Text Content
Data sheet acquired from Harris Semiconductor SCHS016C – Revised September 2003
The CD4001UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
Page Summary Contents For TI Texas Instruments CD4001UB Data Sheet
Manual Details
| Brand | Texas Instruments |
|---|---|
| Pages | 13 |
| File Size | 675.32 KB |
| Published | June 16, 2026 |
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Frequently Asked Questions
What packages are available for the CD4001UB?
It comes in 14-lead hermetic ceramic (F3A), plastic (E), small-outline (M, MT, M96, NSR), and thin shrink small-outline (PW, PWR) packages.
Can CD4001UB be used in automotive applications?
Only if specifically designated by TI as compliant with ISO/TS 16949 requirements; otherwise, TI assumes no responsibility for failures.
Is TI liable if my product fails when using this component?
No, TI assumes no liability for customer product design or application assistance; buyers are solely responsible for their products.
What are the dimensions for the 14-pin PW package?
The plastic small-outline PW package has nominal dimensions including a body width of about 4.30mm to 6.20mm as per mechanical data.