Texas Instruments LP2981 Data Sheet

SLVS521B − JULY 2004 − REVISED OCTOBER 2004

Available in the Texas Instruments DBV (SOT-23) PACKAGE (TOP VIEW)

Nano Star Chip Scale Package Fixed/ADJ Versions

VIN VOUT

Output Tolerance of:

− 0.75% (A Grade)

ON/OFF ADJ/NC†

− 1.25% (Standard Grade) Ultra-Low Dropout, Typically

YEQ, YEU, YZQ, OR YZU (WCSP) PACKAGE

− 200 m V at Full Load of 100 m A

(TOP VIEW)

− 7 m V at 1 m A Wide VIN Range 16 V Max GND ON/OFF Low IQ 600 µA Typ at Full Load of ADJ/NC† 100 m A

VOUT VIN

Shutdown Current 0.01 µA Typ

† Must be left open in fixed-output versions

Fast Transient Response to Line and Load Overcurrent and Thermal Protection High Peak Current Capability Portable Applications − Mobile Phones − Laptops − Personal Digital Assistants (PDAs) − Digital Cameras and Camcorders − CD and MP3 Players

description/ordering information The LP2981 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for both portable and nonportable applications. Available in adjustable version and in fixed voltages of 1.8 V, 2.5 V, 2.7 V, 2.8 V, 2.9 V, 3 V, 3.2 V, 3.3 V, 3.6 V, and 5 V, the family has an output tolerance of 0.75% for the A-grade devices (1.25% for the standard grade) and is capable of delivering 100-m A continuous load current. Standard regulator features, such as over-current and over-temperature protection, are included. The LP2981 has features that make the regulator an ideal candidate for a variety of portable applications:

Low dropout: A PNP pass element allows a typical dropout of 200 m V at 100-m A load current and 7 m V at 1-m A load. Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are considerably lower than those associated with traditional lateral PNP regulators. Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 µA when the ON/OFF pin is pulled low. Small packaging: For the most space-constraint needs, the regulator is available in SOT-23 package and Nano Star chip scale packaging. Nano Star package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Nano Star is a trademark of Texas Instruments.

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