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SAMSUNG Electronics K4S64323LH - F(H)E N G C L F User Manual

Summary

This highly detailed manual provides comprehensive specifications for K4S64323LH Mobile SDRAM—a high-speed synchronous dynamic RAM optimized for demanding mobile and embedded systems. The guide covers essential engineering topics, including functional block diagrams, power-up sequencing, burst transfer modes, operating timing parameters, and environmental temperature ranges (Commercial to Extended). System designers and hardware engineers can use this resource to ensure proper integration of the component into high-bandwidth memory applications, detailing voltage requirements and ensuring maximal system reliability.

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查询K4S64323LH-FC1H供应商

K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM 512K x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

FEATURES GENERAL DESCRIPTION • 2.5V power supply. The K4S64323LH is 67,108,864 bits synchronous high data

• LVCMOS compatible with multiplexed address. rate Dynamic RAM organized as 4 x 524,288 words by 32 bits, • Four banks operation. fabricated with SAMSUNG’s high performance CMOS technol- ogy. Synchronous design allows precise cycle control with the

• MRS cycle with address key programs.

use of system clock and I/O transactions are possible on every

-. CAS latency (1, 2 & 3).

clock cycle. Range of operating frequencies, programmable

-. Burst length (1, 2, 4, 8 & Full page).

burst lengths and programmable latencies allow the same

-. Burst type (Sequential & Interleave).

device to be useful for a variety of high bandwidth and high per-

• EMRS cycle with address key programs.

formance memory system applications.

• All inputs are sampled at the positive going edge of the system clock. • Burst read single-bit write operation. • Special Function Support. -. PASR (Partial Array Self Refresh). -. Internal TCSR (Temperature Compensated Self Refresh) • DQM for masking. • Auto refresh. • 64ms refresh period (4K cycle). • Commercial Temperature Operation (-25°C ~ 70°C). • Extended Temperature Operation (-25°C ~ 85°C). • 90Balls FBGA with 0.8mm ball pitch ( -FXXX : Leaded, -HXXX : Lead Free).

ORDERING INFORMATION

Part No. Max Freq. Interface Package

K4S64323LH-F(H)E/N/G/C/L/F60 166MHz(CL=3)

K4S64323LH-F(H)E/N/G/C/L/F75 133MHz(CL=3)

90 FBGA

LVCMOS

Leaded (Lead Free)

K4S64323LH-F(H)E/N/G/C/L/F1H 105MHz(CL=2)

K4S64323LH-F(H)E/N/G/C/L/F1L

105MHz(CL=3)*1

- F(H)E/N/G : Normal/Low/Low Power, Extended Temperature(-25°C ~ 85°C) - F(H)C/L/F : Normal/Low/Low Power, Commercial Temperature(-25°C ~ 70°C)

NOTES : 1. In case of 40MHz Frequency, CL1 can be supported. 2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake. Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.

February 2004

Page Summary Contents For SAMSUNG Electronics K4S64323LH - F(H)E N G C L F User Manual

Page 1 查询K4S64323LH-FC1H供应商 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM 512K x 32Bit x 4 Banks Mobile SDRAM in 90FBGA FEATURES GENERAL DESCRIPTION • 2.5V power supply. The K4S64323LH is 67,108,864 bits synchro...
Page 2 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM FUNCTIONAL BLOCK DIAGRAM I/O ontrol utput B uffer Data Input Register Bank Select ense A Column Decoder Latency & Burst Length Programming Register ow eco...
Page 3 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM Package Dimension and Pin Configuration < Bottom View*1 > < Top View*2 > 90Ball(6x15) FBGA DQ26 DQ24 VSS VDD DQ23 DQ21 DQ28 VDDQ VSSQ VDDQ VSSQ DQ...
Page 4 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on any pin relative to Vss VIN, VOUT -1.0 ~ 3.6 Voltage on VDD supply relative to Vss VDD, VDDQ -...
Page 5 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM DC CHARACTERISTICS Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25 to 85°C for Extended, -25 to 70°C for Commercial) Version Parame...
Page 6 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM AC OPERATING TEST CONDITIONS(VDD = 2.5V ± 0.2V, TA = -25 to 85°C for Extended, -25 to 70°C for Commercial) Parameter Value Unit AC input levels (Vih/Vil) 0.9 ...
Page 7 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Version Parameter Symbol Unit Note Row active to row active delay t RRD(min) ns RAS to...
Page 8 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM AC CHARACTERISTICS(AC operating conditions unless otherwise noted) Parameter Symbol Unit Note Min Max Min Max Min Max Min Max CAS latency=3 t CC 6.0 7.5 9.5 9...
Page 9 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM SIMPLIFIED TRUTH TABLE COMMAND CKEn-1 CKEn CS RAS CAS WE DQM A10/AP A9 ~ A0 Note Register Mode Register Set OP CODE 1, 2 Auto Refresh Entry Refresh Self Refre...
Page 10 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM A. MODE REGISTER FIELD TABLE TO PROGRAM MODES Register Programmed with Normal MRS Address BA0 ~ BA1 A10/AP A8 A7 A6 A5 A4 A3 A2 A1 A0 "0" Setting fo...
Page 11 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM Partial Array Self Refresh 1. In order to save power consumption, Mobile SDRAM has PASR option. 2. Mobile SDRAM supports 3 kinds of PASR in self refresh mode ...
Page 12 K4S64323LH - F(H)E/N/G/C/L/F Mobile-SDRAM C. BURST SEQUENCE 1. BURST LENGTH = 4 Initial Address Sequential Interleave 2. BURST LENGTH = 8 Initial Address Sequential Interleave February 2004

Manual Details

Brand Electronics
Pages 12
File Size 139.90 KB
Published May 20, 2026
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Frequently Asked Questions

What are the operating temperature ranges?

The device supports Commercial Temperature Operation (-25°C ~ 70°C) and Extended Temperature Operation (-25°C ~ 85°C).

How is power applied to the device?

Apply VDD before or at the same time as VDDQ, maintaining stable clock and NOP for a minimum of 200us.

Which features are supported by this SDRAM?

It supports special functions like PASR (Partial Array Self Refresh), Internal TCSR, Auto refresh, and DQM for masking.