ROHM UCSP75M2 User Guide
Summary
This design support document from ROHM Semiconductor covers the UCSP75M2 ultra-compact surface-mount package used for the BD6373GW motor driver IC. It provides package dimensional drawings, land pattern recommendations, and PCB footprint guidelines for hardware designers integrating this wafer-level chip-scale package into space-constrained applications. The document includes standard legal notices regarding intellectual property, application circuit examples, and limitations of use for general-purpose electronic equipment.
Page 1 Text Content
www.rohm.com 2007.06 - Rev.A 1/4 © 2011 ROHM Co., Ltd. All rights reserved.
Page Summary Contents For ROHM UCSP75M2 User Guide
Manual Details
| Brand | ROHM |
|---|---|
| Pages | 5 |
| File Size | 866.27 KB |
| Published | June 22, 2026 |
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Frequently Asked Questions
Can I use this product with specialized equipment requiring high reliability?
No, the Products are not designed for systems where failure could threaten human life or cause injury (e.g., medical instruments, aerospace machinery).
What safety measures should I implement when using these products?
You must implement safety measures like derating, redundancy, fire control, and fail-safe designs to guard against physical injury or damage.
Is this documentation legally binding for my design project?
No. Use of technical information is intended only to show typical functions; ROHM does not grant any explicit license to use intellectual property.
What if I need a product for a critical life-support system?
If you intend special use, such as medical instruments or transportation equipment, contact a ROHM sales representative before purchasing. Unauthorized use is outside the prescribed scope.