ROHM SH8K14 User Guide
Summary
This datasheet describes the performance and specifications of SH8K14, an N-channel power MOSFET designed for efficient switching applications. Characterized by low on-resistance and integrated protection features, this surface mount component is ideal for system designs requiring reliable electrical control. The manual provides comprehensive documentation, detailing absolute maximum ratings, precise electrical characteristics, detailed dynamic performance curves (including switching times), and thermal stress analysis essential for engineers selecting optimal components for power efficiency circuits.
Page 1 Text Content
Data Sheet
4V Drive Nch + Nch MOSFET SH8K14 Structure Dimensions (Unit : mm)
Silicon N-channel MOSFET SOP8
Features
1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8).
Application Switching
Packaging specifications Inner circuit
Package Taping (8) (7) (6) (5)
Type Code TB Basic ordering unit (pieces) SH8K14
(1) Tr1 Source ∗2 ∗2
(2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate ∗1 ∗1 Absolute maximum ratings (Ta = 25C) (5) Tr2 Drain (6) Tr2 Drain (1) (2) (3) (4)
Parameter Symbol Limits Unit (7) Tr1 Drain
∗1 ESD PROTECTION DIODE
(8) Tr1 Drain
Drain-source voltage VDSS ∗2 BODY DIODE
Gate-source voltage VGSS 20 Continuous ID 7.0
Drain current
Pulsed IDP *1 28
Source current Continuous Is 1.6 (Body Diode) Pulsed Isp *1 *2 2.0 W / TOTAL
Power dissipation PD
1.4 W / ELEMENT
Channel temperature Tch C Range of storage temperature Tstg 55 to 150 C *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
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© 2011 ROHM Co., Ltd. All rights reserved. 1/6 2011.03 - Rev.A
Page Summary Contents For ROHM SH8K14 User Guide
Manual Details
| Brand | ROHM |
|---|---|
| Pages | 7 |
| File Size | 1.07 MB |
| Published | June 04, 2026 |
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Frequently Asked Questions
What is the device's built-in protection against static discharge?
It features built-in Gate-Source Protection Diode.
What is the total power dissipation limit for this element?
The maximum total power dissipation (PD) is 1.4 W / ELEMENT.
How should I account for thermal stress during operation?
When mounting, note that the normalized transient thermal resistance considers pulse width and drainage current.
What are the key electrical specifications regarding on-state resistance?
The static drain-source on-state resistance (Rds(on)) is typically between 25 and 35 mΩ.