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MOTOROLA MTW16N40E Data Sheet

Summary

A robust N-Channel Power MOSFET engineered for high-speed, high-voltage switching up to 400V. This device features advanced termination technology for enhanced performance and reliability in critical applications. The corresponding datasheet provides comprehensive technical specifications, including electrical characteristics, thermal limits, and detailed dynamic data essential for reliable circuit design. It is the ideal component for engineers specifying designs for power supplies, DC-DC converters, and PWM motor control systems.

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查询MTW16N40E供应商

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SEMICONDUCTOR TECHNICAL DATA by MTW16N40E/D

Motorola Preferred Device

TMOS POWER FET

N–Channel Enhancement–Mode Silicon Gate 16 AMPERES

400 VOLTS

This high voltage MOSFET uses an advanced termination

RDS(on) = 0.24 OHM

scheme to provide enhanced voltage–blocking capability without degrading performance over time. In addition, this advanced TMOS E–FET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. Robust High Voltage Termination Avalanche Energy Specified Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode

CASE 340K–01, Style 1

Diode is Characterized for Use in Bridge Circuits

TO–247AE

IDSS and VDS(on) Specified at Elevated Temperature Isolated Mounting Hole Reduces Mounting Hardware

MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

Rating Symbol Value Unit

Drain–Source Voltage VDSS Vdc Drain–Gate Voltage (RGS = 1.0 MΩ) VDGR Vdc Gate–Source Voltage — Continuous VGS Vdc

— Non–Repetitive (tp ≤ 10 ms) VGSM Vpk

Drain Current — Continuous ID Adc

— Continuous @ 100°C ID 9.0 — Single Pulse (tp ≤ 10 µs) IDM Apk

Total Power Dissipation PD Watts Derate above 25°C 1.4 W/°C Operating and Storage Temperature Range TJ, Tstg –55 to 150 °C Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C EAS m J (VDD = 100 Vdc, VGS = 10 Vdc, IL = 16 Apk, L = 6.8 m H, RG = 25 Ω) Thermal Resistance — Junction to Case RθJC 0.70 °C/W

— Junction to Ambient RθJA

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds TL °C Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

1Motorola TMOS Power MOSFET Transistor Device Data

 Motorola, Inc. 1996

Page Summary Contents For MOTOROLA MTW16N40E Data Sheet

Page 1 查询MTW16N40E供应商 Order this document SEMICONDUCTOR TECHNICAL DATA by MTW16N40E/D Motorola Preferred Device TMOS POWER FET N–Channel Enhancement–Mode Silicon Gate 16 AMPERES 400 VOLTS This high voltage M...
Page 2 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage V(BR)DSS (VGS = 0 Vdc, ID = 250 µAdc) Vdc Tem...
Page 3 TYPICAL ELECTRICAL CHARACTERISTICS AI –T –S ES IS TA AI –T –S ES IS TA (O S) S( on ), D S( on , D AI EN (A PS (N AL IZ ED TJ = 25°C VGS = 10 V 8 V VDS = 50 V TJ = –55°C25°C VDS, DRAIN–TO–SOURCE VOLTAG...
Page 4 POWER MOSFET SWITCHING , C AP AC IT AN (p F) Switching behavior is most easily modeled and predicted The capacitance (Ciss) is read from the capacitance curve at by recognizing that the power MOSFET i...
Page 5 VDD = 200 V ID = 16 A ID = 16 A TJ = 25°C S, AT E– TO –S VO LT AG (V LT S) VGS = 10 V QT TJ = 25°C td(off) tr tf td(on) , S EN (A PS QG, TOTAL GATE CHARGE (n C) RG, GATE RESISTANCE (OHMS) Figure 8. Ga...
Page 6 SAFE OPERATING AREA , D AI EN (A PS r(t AL IZ ED FF EC TI VE VGS = 20 V ID = 16 A µs TR AN SI EN TH ER AL ES IS TA SINGLE PULSE TC = 25°C THERMAL LIMIT PACKAGE LIMIT dc 0.2 RDS(on) LIMIT VDS, DRAIN–TO...
Page 7 PACKAGE DIMENSIONS –B– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. INCHESMILLIMETERS DIM MIN MAX MIN MAX 19.7 20.3 0.776 0.799 15.3 15.9 0.602 0...
Page 8 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any par...

Manual Details

Brand Motorola
Pages 8
File Size 218.46 KB
Published June 01, 2026
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Frequently Asked Questions

What types of applications is this power FET best suited for?

It is designed for high voltage, high speed switching in applications such as power supplies, converters, and PWM motor controls.

What does the device offer for superior performance in bridge circuits?

It features a source-to-drain diode recovery time comparable to a discrete fast recovery diode, offering additional safety margin against transient voltage spikes.

What are the specified maximum ratings for voltage and current (T=25°C)?

The maximum drain–source voltage is 400 Vdc, and the continuous drain current (Id) at 100°C is 9.0 Adc.

How reliable is the device during high-energy switching events?

It is designed to withstand high energy in both avalanche and commutation modes, with a specified Avalanche Energy (EAS) of 870 mJ.