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MOTOROLA MMSF3350 Data Sheet

Summary

Optimize your power systems with WaveFET® Power MOSFETs, designed for low voltage, high-speed switching applications requiring maximum efficiency. Ideal for developing compact, battery-powered devices such as dc–dc converters and portable electronics (e.g., computers, cellular phones). This technical manual provides comprehensive details on electrical characteristics, thermal ratings, and performance parameters (including low on-resistance and avalanche energy) to ensure robust design integration.

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查询MMSF3350/D供应商

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SEMICONDUCTOR TECHNICAL DATA by MMSF3350/D

SINGLE TMOS

!   ! POWER MOSFET

30 VOLTS Wave FET devices are an advanced series of power MOSFETs which utilize Motorola’s RDS(on) = 11 m

latest MOSFET technology process to achieve the lowest possible on–resistance per silicon area. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. Wave FET devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the CASE 751–06, Style 12 guesswork in designs where inductive loads are switched and offer additional safety margin SO–8 against unexpected voltage transients. Characterized Over a Wide Range of Power Ratings Ultralow RDS(on) Provides Higher Efficiency and Extends Battery Life in Portable Applications Source Drain Logic Level Gate Drive — Can Be Driven by Source

Drain

Logic ICs

Source Drain

Diode Is Characterized for Use In Bridge Circuits

Gate Drain

Diode Exhibits High Speed, With Soft Recovery IDSS Specified at Elevated Temperature TOP VIEW Avalanche Energy Specified Miniature SO–8 Surface Mount Package — Saves Board Space

MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)

Parameter Symbol Value Unit

Drain–to–Source Voltage VDSS Vdc Drain–to–Gate Voltage VDGR Vdc Gate–to–Source Voltage VGS ±20 Vdc Gate–to–Source Operating Voltage VGS ±16 Vdc Operating and Storage Temperature Range TJ, Tstg –55 to 150 °C Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C EAS m J (VDD = 25 Vdc, VGS = 10 Vdc, L = 20 m H, IL(pk) = 10 A, VDS = 30 Vdc)

DEVICE MARKING ORDERING INFORMATION

Device Reel Size Tape Width Quantity

MMSF3350R2 13″ 12 mm embossed tape 2500 units

This document contains information on a new product. Specifications and information herein are subject to change without notice. HDTMOS and Wave FET are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company.

REV 1

1Motorola TMOS Power MOSFET Transistor Device Data

 Motorola, Inc. 1998

Page Summary Contents For MOTOROLA MMSF3350 Data Sheet

Page 1 查询MMSF3350/D供应商 Order this document SEMICONDUCTOR TECHNICAL DATA by MMSF3350/D SINGLE TMOS !   ! POWER MOSFET 30 VOLTS Wave FET devices are an advanced series of power MOSFETs which utilize Moto...
Page 2 POWER RATINGS (TJ = 25°C unless otherwise specified) Parameter Symbol Value Unit Drain Current — Continuous @ TA = 25°C ID Adc Drain Current — Continuous @ TA = 100°C Mounted on 1 inch square ID 9.2 A...
Page 3 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage V(BR)DSS Vdc (VGS = 0 Vdc, ID = 250 Adc)...
Page 4 TYPICAL ELECTRICAL CHARACTERISTICS AI –T –S ES IS TA S( on AI –T –S ES IS TA (O S) , D AI EN (A PS S( on (N AL IZ ED 10 V 4.1 V 3.9 V VDS ≥ 10 V TJ = 25°C VGS = 3.7 V 3.5 V TJ = 125°C 25°C VDS, DRAIN–...
Page 5 POWER MOSFET SWITCHING Switching behavior is most easily modeled and predicted The capacitance (Ciss) is read from the capacitance curve at by recognizing that the power MOSFET is charge controlled. a...
Page 6 S, AT E– TO –S VO LT AG (V LT S) VGS td(off) Q1 TJ = 25°C ID = 2 A td(on) , S EN (A PS Qg, TOTAL GATE CHARGE (n C) RG, GATE RESISTANCE (OHMS) Figure 8. Gate–To–Source and Drain–To–Source Figure 9. Res...
Page 7 di/dt = 300 A/µs Standard Cell Density , D AI EN (A PS trr High Cell Density trr , S EN t, TIME Figure 11. Reverse Recovery Time (trr) SAFE OPERATING AREA The Forward Biased Safe Operating Area curves...
Page 8 TYPICAL ELECTRICAL CHARACTERISTICS th ja (t) , E FF EC TI VE AN SI EN th ja (t) , E FF EC TI VE AN SI EN TH ER AL ES IS TA TH ER AL ES IS TA PO ER (W MOUNTED TO MINIMUM RECOMMENDED FOOTPRINT DUTY CYCL...
Page 9 INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total between the board and ...
Page 10 TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control line on the graph shows the actual temperature that might be settings that will give the desired heat patte...
Page 11 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 P...
Page 12 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any par...

Manual Details

Brand Motorola
Pages 12
File Size 235.42 KB
Published May 29, 2026
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Frequently Asked Questions

What types of applications is the WaveFET MOSFET designed for?

It is optimized for low voltage, high speed switching in areas where power efficiency is important, such as DC–DC converters and portable battery powered products.

Can this device be used in critical life support or surgical implant systems?

No. Motorola specifies that these components are not intended or authorized for use in any system supporting life or surgical implants.

Does the packaging save space on a circuit board?

Yes, it comes in a Miniature SO–8 Surface Mount Package which helps to save board space during mounting and design.