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Motorola MCM69R736A•MCM69R818A Data Sheet

Summary

Engineered for critical, high-speed memory needs, this synchronous SRAM is a high-performance 4 Mbit device ideal for telecommunication switches, ATM networks, and robust secondary cache applications. Professionals and system designers rely on this detailed manual source for everything required to integrate the component. It provides comprehensive technical specifications, functional block diagrams, precise pin assignments, and advanced operational guidance—including support for HSTL inputs and programmable output impedance—ensuring optimal performance in demanding electronic designs.

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查询MCM69R736A供应商

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SEMICONDUCTOR TECHNICAL DATA by MCM69R736A/D

MCM69R736A

Advance Information

MCM69R818A

4M Late Write HSTL The MCM69R736A/818A is a 4 megabit synchronous late write fast static RAM designed to provide high performance in secondary cache and ATM switch, Telecom, and other high speed memory applications. The MCM69R818A organized as 256K words by 18 bits, and the MCM69R736A organized as 128K words by 36 bits wide are fabricated in Motorola’s high performance silicon gate Bi CMOS technology.

ZP PACKAGE

The differential CK clock inputs control the timing of read/write operations of

the RAM. At the rising edge of the CK clock all addresses, write enables, and

CASE 999–01

synchronous selects are registered. An internal buffer and special logic enable the memory to accept write data on the rising edge of the CK clock a cycle after address and control signals. Read data is driven on the rising edge of the CK clock also. The RAM uses HSTL inputs and outputs. The adjustable input trip – point (Vref) and output voltage (VDDQ) gives the system designer greater flexibility in optimizing system performance. The synchronous write and byte enables allow writing to individual bytes or the entire word. The impedance of the output buffers is programmable allowing the outputs to match the impedance of the circuit traces which reduces signal reflections. Byte Write Control Single 3.3 V +10%, – 5% Operation HSTL – I/O (JEDEC Standard JESD8–6 Class I Compatible) HSTL – User Selectable Input Trip–Point HSTL – Compatible Programmable Impedance Output Drivers Register to Register Synchronous Operation Asynchronous Output Enable Boundary Scan (JTAG) IEEE 1149.1 Compatible Differential Clock Inputs Optional x 18 or x 36 organization MCM69R736A/818A–5 = 5 ns MCM69R736A/818A–6 = 6 ns MCM69R736A/818A–7 = 7 ns MCM69R736A/818A–8 = 8 ns Sleep Mode Operation (ZZ Pin) 119 Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array (PBGA) Package

This document contains information on a new product. Specifications and information herein are subject to change without notice. REV 1 8/20/97

MOTOROLA FAST SRAM  Motorola, Inc. 1997 MCM69R736A•MCM69R818A

Page Summary Contents For Motorola MCM69R736A•MCM69R818A Data Sheet

Page 1 查询MCM69R736A供应商 Order this document SEMICONDUCTOR TECHNICAL DATA by MCM69R736A/D MCM69R736A Advance Information MCM69R818A 4M Late Write HSTL The MCM69R736A/818A is a 4 megabit synchronous late write ...
Page 2 FUNCTIONAL BLOCK DIAGRAM DATA IN ADDRESS SA REGISTERMEMORY REGISTERS ARRAY DATA OUT REGISTER SW SW CONTROL REGISTERS LOGIC REGISTERS PIN ASSIGNMENTS TOP VIEW MCM69R736A MCM69R818A VDDQ SA SA NC SA SA ...
Page 3 MCM69R736A PIN DESCRIPTIONS PBGA Pin Locations Symbol Type Description 4K CK Input Address, data in and control input register clock. Active high. 4L CK Input Address, data in and control input regist...
Page 4 MCM69R818A PIN DESCRIPTIONS PBGA Pin Locations Symbol Type Description 4K CK Input Address, data in and control input register clock. Active high. 4L CK Input Address, data in and control input regist...
Page 5 ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS, See Note 1) This device contains circuitry to protect the Rating Symbol Value Unit inputs against damage due to high static volt- Core Supply Volt...
Page 6 DC OPERATING CONDITIONS AND CHARACTERISTICS (0°C ≤ TA ≤ 70°C, Unless Otherwise Noted) RECOMMENDED OPERATING CONDITIONS (See Notes 1 through 4) Typical Typical Typical Typical Parameter Symbol Min –5 –...
Page 7 PROGRAMMABLE IMPEDANCE OUTPUT BUFFER OPERATION Refer to Functional Operation section for more detailed explanation. DC OUTPUT BUFFER CHARACTERISTICS – PROGRAMMABLE IMPEDANCE PUSH–PULL OUTPUT BUFFER MO...
Page 8 AC OPERATING CONDITIONS AND CHARACTERISTICS (0°C ≤ TA ≤ 70°C, Unless Otherwise Noted) Input Pulse Levels 0.25 to 1.25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Input Timing Re...
Page 9 AC INPUT CHARACTERISTICS Parameter Symbol Min Max Note AC Input Logic High (See Figure 4) VIH (ac) Vref + 200 m V AC Input Logic Low (See Figures 2 and 4) VIL (ac) Vref – 200 m V Input Reference Peak ...
Page 10 REGISTER/REGISTER READ–WRITE–READ CYCLES KHKH KHKLt AVKH KLKH SA A0 A1 A2 A3 A4 KHQZ KHQX1 KHQX KHDX KHQX DVKH DQx Q–1 Q0 Q1 D2 Q3 MCM69R736A•MCM69R818A MOTOROLA FAST SRAM
Page 11 REGISTER/REGISTER READ–WRITE–READ (G Controlled) KHKH KHKLt AVKH KLKH SA A0 A1 A2 A3 A4 GLQX GHQX DQx Q–1 Q0 Q1 D2 Q3 MOTOROLA FAST SRAM MCM69R736A•MCM69R818A
Page 12 FUNCTIONAL OPERATION LATE WRITE The write address is sampled on the first rising edge of READ AND WRITE OPERATIONS clock and write data is sampled on the following rising edge. All control signals exc...
Page 13 SERIAL BOUNDARY SCAN TEST ACCESS PORT OPERATION OVERVIEW 1149.1 compliant TAPs. The TAP operates using convention- al JEDEC Standard 8–1B Low Voltage (3.3 V) TTL / CMOS logic level signaling. The seri...
Page 14 TAP AC OPERATING CONDITIONS AND CHARACTERISTICS (0°C ≤ TA ≤ 70°C, Unless Otherwise Noted) Input Pulse Levels 0 to 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Test Loa...
Page 15 TEST ACCESS PORT PINS BOUNDARY SCAN REGISTER The boundary scan register is identical in length to the TCK – TEST CLOCK (INPUT) number of active input and I/O connections on the RAM (not Clocks all TAP...
Page 16 MCM69R736A Bump/Bit Scan Order MCM69R818A Bump/Bit Scan Order BIT Signal Bump Bit Signal Bump Bit Signal Bump Bit Signal Bump Name ID Name ID Name ID Name ID M2 5R SA 3B M2 5R SBb 3G SA 4P NC 2B SA 6T...
Page 17 TAP CONTROLLER INSTRUCTION SET expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set–up plus hold OVERVIEW time (t CS plus t CH). The RAMs clock inputs...
Page 18 STANDARD (PUBLIC) INSTRUCTION CODES Instruction Code* Description EXTEST Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all RAM outputs to High–Z state. *NOT...
Page 19 ORDERING INFORMATION (Order by Full Part Number) 69R736A MCM 69R818A XX R = Tape and Reel, Blank = Tray Motorola Memory Prefix Speed (5 = 5 ns, 6 = 6 ns, 7 = 7 ns, 8 = 8 ns) Part Number Package (ZP = ...
Page 20 PACKAGE DIMENSIONS ZP PACKAGE 7 X 17 BUMP PBGA CASE 999–01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.PIN 1A IDENTIFIER –W– MILLIMETERS INCHES D...

Manual Details

Brand Motorola
Pages 20
File Size 229.76 KB
Published May 31, 2026
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Frequently Asked Questions

How is signal reflection minimized on the output data lines?

The output buffers have programmable impedance, which allows them to match the impedance of the circuit traces.

What standard does the device support for testing communication interfaces?

The RAM supports Boundary Scan (JTAG) and is compatible with IEEE 1149.1.

How can I put the memory into a low-power state?

Activate the ZZ pin to put the module into Sleep Mode Operation.

At what point are addresses and control signals registered during operation?

All addresses, write enables, and synchronous selects are registered on the rising edge of the CK clock.