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Fairchild MOSFET-Based Load Switch Data Manual

Summary

This comprehensive datasheet provides essential knowledge for designing reliable high-power electronics. It details the principles of heat flow in Power MOSFETs, guiding users through calculating junction-to-ambient thermal resistance ($R_{\theta JA}$). The manual covers advanced measurement techniques, including K factor determination and pulsed testing methods, enabling precise characterization of both steady-state and transient performance. Ideal for power circuit designers and reliability engineers who require rigorous thermal data to optimize product safety and longevity across varied operating environments.

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Page 1 Text Content

Rev D, October 1998

Page Summary Contents For Fairchild MOSFET-Based Load Switch Data Manual

Page 1 Rev D, October 1998
Page 5 Figure 4. Measured FDC6329L Dynamic Waveforms Figure 5. SPICE verification on FDC6329L Dynamic Waveforms Figure 6. SPICE result of FDC6329L VDROP vs IL
Page 6 Appendix A Heat Flow Theory Applied to Power MOSFETs When a Power MOSFET operates with an appreciable current, its junction temperature is el- evated. It is important to quantify its thermal limits in...
Page 7 where the case of a Power MOSFET is defined at the point of contact between the drain lead(s) and the mounting pad surface. RθJC can be controlled and measured by the component manufac- turer independ...
Page 8 0.5 r(t NO RM AL IZ ED FF EC TI VE TR AN SI EN TH ER AL ES IS TA CE 0.1 R (t) = r(t) * R θJAθJA R = See Note 1a, b, θJA 0.02 P(pk) Single Pulse t 2 T - T = P * R (t)θJAAJ Duty Cycle, D = t /t1 t , TIM...
Page 9 various packages is shown in figure 8. Note RθJC can vary with die size and the effect is more prominent as RθJC decreases. Ty ic /W Junction-to-Case Thermal Resistance * Dual Leadframes ** Triple Lea...
Page 10 References [1] K. Azar, S.S. Pan, J. Parry, H. Rosten, “Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling,” IEEE 10th annual Semi-Therm C...
Page 11 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ ISOP...

Manual Details

Brand Fairchild
Pages 11
File Size 1.42 MB
Published June 18, 2026
6 views

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Frequently Asked Questions

Can I use this component in life support or critical applications?

No, it requires express written authorization from Fairchild Semiconductor Corporation for use in life support devices.

How do I calculate the junction-to-ambient thermal resistance (R_theta JA)?

It is calculated by summing the junction-to-case and case-to-ambient resistances: R_theta JA = R_theta JC + R_theta CA.

What is crucial when using datasheet thermal data for my application?

The user must always be aware of the test conditions and justify the compatibility, as this resistance depends heavily on variable factors.

How do I know if a datasheet provides final product specifications?

If the document is marked 'Full Production,' it contains the final specifications. Preliminary data may change.