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Fairchild FDC602P User Manual

Summary

This specialized P-Channel 2.5V PowerTrench MOSFET is engineered for demanding power management tasks, making it ideal for applications such as battery protection, load switching, and sophisticated battery management systems. The comprehensive technical manual provides detailed electrical characteristics, including low $R_{DS(ON)}$, fast switching times, and thermal performance data across extreme operating temperatures. This resource is essential for engineers designing high-efficiency circuits that require reliable power control and minimized energy loss.

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Page 1 Text Content

April 2001

FDC602P P-Channel 2.5V Power Trench Specified MOSFET General Description Features This P-Channel 2.5V specified MOSFET uses a rugged

• –5.5 A, –20 V RDS(ON) = 35 mΩ @ VGS = –4.5 V

gate version of Fairchild’s advanced Power Trench

RDS(ON) = 50 mΩ @ VGS = –2.5 V

process. It has been optimized for power management applications with a wide range of gate drive voltage

• Fast switching speed

• High performance trench technology for extremely

Applications

low RDS(ON)

• Battery management • Load switch • Battery protection

Super SOT -6TM

Absolute Maximum Ratings TA=25o C unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage –20 V VGSS Gate-Source Voltage ±12 V ID Drain Current – Continuous (Note 1a) –5.5 A – Pulsed –20

Maximum Power Dissipation (Note 1a) 1.6 W PD (Note 1b) 0.8

TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C

Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 78 °C/W RθJC Thermal Resistance, Junction-to-Case (Note 1) 30 °C/W

Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity .602 FDC602P 7’’ 8mm 3000 units

2001 Fairchild Semiconductor Corporation FDC602P Rev C(W)

Page Summary Contents For Fairchild FDC602P User Manual

Page 1 April 2001 FDC602P P-Channel 2.5V Power Trench Specified MOSFET General Description Features This P-Channel 2.5V specified MOSFET uses a rugged • –5.5 A, –20 V RDS(ON) = 35 mΩ @ VGS = –4.5 V gate ver...
Page 2 Electrical Characteristics TA = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆B...
Page 3 Typical Characteristics -I , D IN (A -I IN (A (O ), N LI ZE D, D IN -S -R IS TA VGS =-4.5V 1.6 VGS = -2.5V 0.5 1.5 2.5 -VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A) Figure 1. On-Region Char...
Page 4 Typical Characteristics -I IN (A -V , G TE -S LT (V D, D r( t) , N IZ IV IE IS VDS =-5.0V f = 1 MHz ID = -5.5A -10V CISS VGS = 0 V Qg, GATE CHARGE (n C) -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gat...
Page 5 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST...

Manual Details

Brand Fairchild
Pages 5
File Size 65.26 KB
Published May 31, 2026
33 views

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Frequently Asked Questions

What are the absolute maximum voltage limits for this MOSFET?

The Drain-Source Voltage (VDS) is rated up to -20 V, and the Gate-Source Voltage (VGS) is rated at ±12 V.

What are the key features of this PowerTrench MOSFET?

It offers fast switching speed, low R_DS(ON), and high performance trench technology for power management applications.

How is the thermal resistance calculated?

R is the sum of the junction-to-case (qJC) and case-to-ambient (qCA) resistance, where qJA accounts for heatsinking on an FR-4 board.

What are typical applications for this device?

It is optimized for power management in areas like battery management, load switches, and battery protection.