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Fairchild AN-376 Logic-System Design Techniques for Reduced Switching-CMOS Power Data Sheet

Summary

This technical guide details advanced methods for reducing power consumption across CMOS-based logic systems. It analyzes the two primary causes of power drain—static (quiescent) current and dynamic switching currents—and provides formulas to accurately estimate total system power dissipation. The manual is essential reading for electrical engineers designing low-power, battery-operated circuits, offering actionable techniques such as minimizing operating frequency and using 3-state buffers to achieve maximum efficiency during both active operation and controlled power-down states.

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-376 L ic-S ystem esig Tech iq es R ed ce S itch in -C er

AN-376 Fairchild Semiconductor Application Note August 1984 Revised October 2002

Logic-System Design Techniques Reduce Switching-CMOS Power By adopting certain techniques in the design of your CMOS-based logic system, you can effect dramatic reductions in the transitional power these zero-quiescent-current devices consume when switching. This article describes ways to reduce the power consump- The currents in this expression are caused by pull-up and tion in logic designs using high-speed CMOS ICs. The load resistors and TTL, NMOS and linear circuits in the MM74HC logic family has near-zero power dissipation system. If it's appreciable—although unlikely—you can when in the quiescent mode. Its only substantial power include the very small quiescent ICC of MM74HC devices. drain arises from dynamic switching currents. Traditional Generally, the worst-case ICC values in the CMOS ICs' TTL and NMOS systems do not share this low-power fea-

datasheets are very conservative. Typical values range

ture, requiring instead that you reduce power by selecting

from ten to 100 times less than the limits; moreover, it's

low-power ICs and external components.

almost statistically impossible for a system to contain all

The CMOS device is inherently efficient, but you can worst-case devices. greatly enhance system efficiency by designing around the

As pointed out earlier, the major contributors to CMOS ICs'

following guidelines:

power dissipation are dynamic switching currents. Figure 1

minimizing effective system operating frequency; is a schematic diagram of one MM74HC00 NAND gate,

minimizing static DC current paths and it shows the dynamic currents that result from switch- (e.g., in pull-up or pull-down resistors); ing one input LOW-to-HIGH. When the IC is not switching, there's no DC current path from VCC to ground except for

putting the logic to sleep (by removing the clock);

leakage. This is because whenever an n-channel device is

capitalizing on power-down situations.

ON, its complementary p-channel partner is OFF.

Total system power dissipation is the sum of two compo-

CMOS power consumption is caused by the transient cur-

nents: static (or quiescent) and dynamic power. LS TTL

rents that charge and discharge internal and external

systems consume such a great amount of quiescent power

capacitances during logic transitions. As frequency

that the dynamic component pales into insignificance.

increases, these currents naturally increase. You can't

When using MM74HC logic in power-critical applications,

measure these currents or their associated capacitances

however, you must consider both components. The follow-

individually, but you can measure the total current. You can

ing sections describe how to determine system power by

equate this total current to a power-dissipation capacitance

using MM74HC devices' power-dissipation-capacitance

(CPD) as follows:

(CPD) specifications. The text also discusses a few power-

ICC = (CPD + CL)(VCC)(f IC), (2)

reduction philosophies and some of the differences in con- sumption for MM74HCT TTL-compatible CMOS logic. where ICC is the supply current, VCC is the supply voltage, Because system power is simply total ICC times the supply

f IC is the input toggle rate and CL is the toggled load capac-

voltage, the calculations treat power and current inter-

itance. Referring again to Figure 1, the load current IL

changeably.

results from switching the load capacitance. To obtain the

Calculating the quiescent power is just as easy—the sum internal equivalent capacitance, you must subtract the load of the DC currents times the supply voltage. Thus, total current from ICC. system quiescent power is PSYSTEM = (ICC1 + ICC2 + . ICCn) VCC. (1)

FIGURE 1. Principal contributors to CMOS power consumption, these transient currents are the

result of transitional charging and discharging of internal and load capacitances. The average currents are naturally a function of the operating frequency.

Published in EDN Magazine Copyright 1984 Cahners Publishing Co.

© 2002 Fairchild Semiconductor Corporation AN008128 www.fairchildsemi.com

Page Summary Contents For Fairchild AN-376 Logic-System Design Techniques for Reduced Switching-CMOS Power Data Sheet

Page 1 -376 L ic-S ystem esig Tech iq es R ed ce S itch in -C er AN-376 Fairchild Semiconductor Application Note August 1984 Revised October 2002 Logic-System Design Techniques Reduce Switching-CMOS Power By...
Page 2 Using the CPD figure specified in datasheets, you can esti- Test CPD in Realistic Situations mate the current consumption of each device in your sys- tem if you know the toggling frequency. By multipl...
Page 3 -376 Test CPD in Realistic Situations (Continued) Latches: The device is clocked and data is toggled every other clock pulse. Other preset or clear inputs are held to enable output toggling. If the de...
Page 4 These rules notwithstanding, it's rarely necessary to go Tailor f, C to Device Type through a detailed analysis of each IC. In most instances, a To make practical use of the foregoing methods, the fol...
Page 5 -376 Tailor f, C to Device Type (Continued) A one-shot’s overall power consumption is its quiescent of several milliamps per IC, significantly less than that of power plus the power consumed by its ti...
Page 6 More Special Cases: HCT (Continued) current. The static portion is the sum of the number of TTL ICC is the datasheet’s per-input spec. This expression can logic-One inputs times their High-period duty...
Page 7 -376 Now Let’s Reduce Power (Continued) FIGURE 7. Reducing clock rate—but not throughput—this scheme allows you to reduce power by clocking a system's n subsections only as fast as needed, instead of ...
Page 8 Now Let’s Reduce Power (Continued) FIGURE 9. Switch your system’s clock frequency for reduced power consumption. The circuit shown is a software-selectable oscillator for a microprocessor system. It’s...
Page 9 uses a MM74HC244 whose input is tied to its output. If the Be Wary of Static Loads terminating resistors must be completely turned off, use the Previous sections discussed the effects of capacitive lo...
Page 10 down, you should respect several criteria to avoid spurious The Final Solution: Power Down signals during the power-down period, and to eliminate When all else fails, the best way to reduce system pow...
Page 11 -376 The Final Solution: Power Down (Continued) FIGURE 13. Solutions to the problems in Figure 12, these configurations protect CMOS circuits’ inputs and outputs in power-down situations. The brute-fo...
Page 12 The Final Solution: Power Down (Continued) Referring again to Figure 12(b) and Figure 12(c), the input In addition to ensuring that power-down proceeds protection diodes and the output parasitic diode...
Page 13 -376 L ic-S ystem esig Tech iq es R ed ce S itch in -C er The Final Solution: Power Down (Continued) FIGURE 16. Prevent spurious host-processor write operations in battery-backup systems by using this...

Manual Details

Brand Fairchild
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Published June 20, 2026
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Frequently Asked Questions

How is CMOS power consumption calculated?

Total system power is the sum of static (quiescent) and dynamic power, determined by current limits, capacitance, supply voltage, and input toggle rate.

What are the primary sources of CMOS power usage?

The major contributors to CMOS ICs’ power dissipation are dynamic switching currents from charging/discharging capacitances, and small quiescent leakage currents when not switching.

How can system efficiency be improved in CMOS circuits?

By minimizing effective system operating frequency, designing around worst-case conditions, and implementing power-down methods (like using 3-STATE buffers).

What is the risk of using high-speed CMOS ICs regarding power?

These ICs can draw significant dynamic currents due to transient charging and discharging of internal and external capacitances during logic transitions.