Texas Instruments TIBPAL20L8-10C, TIBPAL20R4-10C, TIBPAL20R6-10C, TIBPAL20R8-10C Data Sheet
Summary
These high-performance PAL circuits provide advanced programmable logic solutions utilizing Low-Power Schottky technology. They offer a reliable and faster functional alternative to conventional logic devices, simplifying complex circuit design due to their ease of programmability. This manual serves as a comprehensive technical guide for electronics engineers, detailing precise operational parameters, pin assignments, timing characteristics (like propagation delay and maximum frequency), and power-up reliability features necessary for integrating the chips into custom, highly reliable electronic systems.
Page 1 Text Content
TIBPAL20L8-10C, TIBPAL20R4-10C, TIBPAL20R6-10C, TIBPAL20R8-10C
HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS
SRPS008A – D3336, OCTOBER 1989 – REVISED MARCH 1992
TIBPAL20L8’
High-Performance Operation:
JT OR NT PACKAGE
fmax (no feedback)
(TOP VIEW)
TIBPAL20R’ 71.4 MHz fmax (internal feedback)
TIBPAL20R’ 58.8 MHz fmax (external feedback) TIBPAL20R’ 55.5 MHz
Propagation Delay
TIBPAL20’ 10 ns Max
I/O Functionally Equivalent, but Faster Than I/O Existing 24-Pin PLD Circuits I/O I/O
Preload Capability on Output Registers Simplifies Testing
Power-Up Clear on Registered Devices (All GND
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
TIBPAL20L8’ FN PACKAGE
Package Options Include Plastic Chip
Carriers in Addition to Plastic and Ceramic (TOP VIEW)
DIPs Security Fuse Prevents Duplication Dependable Texas Instruments Quality and
Reliability
3-STATE REGISTERED
DEVICE PORT NC NC
INPUTS O OUTPUTS Q OUTPUTS
PAL20L8
PAL20R4 4 (3-state buffers)
PAL20R6 6 (3-state buffers) PAL20R8 8 (3-state buffers)
description These programmable array logic devices feature
NC No internal connection
high speed and functional equivalency when Pin assignments in operating mode compared with currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space. All of the register outputs are set to a low level during power up. Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence. The TIBPAL20’ C series is characterized from 0°C to 75°C.
These devices are covered by U.S. Patent 4,410,987. IMPACT-X is a trademark of Texas Instruments Incorporated. PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date. Copyright 1992, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page Summary Contents For Texas Instruments TIBPAL20L8-10C, TIBPAL20R4-10C, TIBPAL20R6-10C, TIBPAL20R8-10C Data Sheet
Manual Details
| Brand | Texas Instruments |
|---|---|
| Pages | 21 |
| File Size | 212.48 KB |
| Published | June 18, 2026 |
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Frequently Asked Questions
What performance enhancements do the IMPACT-X PAL circuits offer?
They are functionally equivalent but faster than existing 24-Pin PLD Circuits, utilizing Advanced Low-Power Schottky technology.
Does the device feature preload capability for output registers?
Yes, it provides preload capability on Output Registers (I/O 10) to simplify testing and allow setting an initial state prior to test sequence.
How does the PLC function during power-up?
All register outputs are set to a low level; however, voltage levels at the output pins will go high upon power-up.
Are carrier options available for circuit boards?
Yes, plastic chip carriers and ceramic DIPs are available in addition to standard plastic and ceramic DIP packages, allowing for reduced board space.