TEXAS INSTRUMENTS 54AC16244 74AC16244 DATA SHEET
Summary
These technical specifications describe the AC series of high-performance 16-bit buffers and line drivers, designed for optimizing digital signal integrity in complex systems. The product features true outputs and three-state functionality, making them ideal for bus lines, clock distribution, and memory address/data interfacing (supporting up to 16 bits). This datasheet provides professional hardware designers and electrical engineers with detailed information on operational voltage ranges, packaging options (including military temperature grades), and the circuit implementation necessary for robust high-speed communication.
Page 1 Text Content
54AC16244, 74AC16244 16-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCAS120A – MARCH 1990 – REVISED APRIL 1996 Members of the Texas Instruments 54AC16244 WD PACKAGE
74AC16244 DGG OR DL PACKAGE
Widebus Family
(TOP VIEW)
3-State Outputs Drive Bus Lines or Buffer Memory Address Registers 1OE 2OE
Flow-Through Architecture Optimizes PCB 1Y1 1A1 Layout 1Y2 1A2 GND GND
Distributed VCC and GND Configuration
Minimizes High-Speed Switching Noise 1Y3 1A3 1Y4 1A4
EPIC (Enhanced-Performance Implanted
VCC VCC
CMOS) 1-m Process
500-m A Typical Latch-Up Immunity at
GND GND
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages Using 25-mil
Center-to-Center Pin Spacings, and 380-mil
Fine-Pitch Ceramic Flat (WD) Packages
GND GND
Using 25-mil Center-to-Center Pin Spacings
description
VCC VCC The ’AC16244 are 16-bit buffers/line drivers 4Y1 4A1 designed specifically to improve both the 4Y2 4A2 performance and density of 3-state memory GND GND address drivers, clock drivers, and bus-oriented 4Y3 4A3
receivers and transmitters. They can be used as 4Y4 4A4 four 4-bit buffers, two 8-bit buffers, or one 16-bit 4OE 3OE buffer. These devices provide true outputs and symmetrical active-low output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. The 74AC16244 is packaged in the TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54AC16244 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74AC16244 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE (each driver) INPUTS OUTPUT OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page Summary Contents For TEXAS INSTRUMENTS 54AC16244 74AC16244 DATA SHEET
Manual Details
| Brand | Texas Instruments |
|---|---|
| Pages | 11 |
| File Size | 180.33 KB |
| Published | June 06, 2026 |
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Frequently Asked Questions
How does the 3-state output work for data transmission?
When the Output Enable (OE) is low, noninverted data passes from the A inputs to the Y outputs. When OE is high, the outputs are in a high-impedance state.
What is the temperature range of the 54AC16244 version?
The 54AC16244 is characterized for stable operation over the full military temperature range of –55°C to 125°C.
How many different buffer configurations can this device handle?
It can function as four 4-bit buffers, two 8-bit buffers, or one single 16-bit buffer.
What is the maximum continuous output current capacity (O_CC)?
The continuous output voltage range supports up to ±50 mA of current.
What are the available physical package options for this device?
Package options include Plastic Small-Outline (DL), Small-Outline (DGG), and Fine-Pitch Ceramic Flat (WD) packages.