# A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

ROHM ES6U3 Data Manual

Summary

This integrated semiconductor device combines a MOSFET and a Schottky barrier diode (ES6U3) optimized for high-speed switching applications. The comprehensive manual provides detailed technical specifications, including absolute maximum ratings, electrical characteristics, and multiple performance curves necessary for accurate circuit design. This product is essential for engineers developing general electronic equipment, such as sophisticated audio/visual gear, communication devices, or other switching power systems requiring reliable, low on-resistance performance in critical circuits.

📄 Preview PAGE OF 5

Page 1 Text Content

4V Drive Nch+SBD MOSFET ES6U3 Structure Dimensions (Unit : mm) Silicon N-channel MOSFET /

WEMT6

Schottky barrier diode

Features 1) Nch MOSFET and schottky barrier diode are put in WEMT6 package.

2) High-speed switching, Low On-resistance. 3) Built-in Low VF schottky barrier diode.

Abbriviated symbol : U03

Applications Inner circuit Switching

Package specifications

Package Taping

Type Code T2R

(1)Gate Basic ordering unit (pieces) ∗1 (2)Source (3)Anode

ES6U3 (4)Cathode

(5)Drain

∗1 ESD protection diode

(6)Drain

∗2 Body diode

Absolute maximum ratings (Ta=25°C) <MOSFET>

Parameter Symbol Limits Unit

Drain-source voltage VVDSS

Gate-source voltage ±20 VVGSS Continuous ±1.4 AID

Drain current

Pulsed ±2.8 AIDP Source current Continuous 0.5 AIS

(Body diode) ∗1

Pulsed 2.8 AISP

°CTch Channel temperature

∗2PDPower dissipation W / ELEMENT0.7

∗1 Pw≤10µs, Duty cycle≤1% ∗2 Mounted on a ceramic board

Parameter Symbol Limits Unit

Repetitive peak reverse voltage VVRM Reverse voltage VVR

Forward current 0.5 AIF

Forward current surge peak AIFSM Junction temperature Tj °C

∗2Power dissipation 0.5 W / ELEMENTPD

∗1 60Hz 1cyc. ∗2 Mounted on a ceramic board

<MOSFET and Di>

Parameter Symbol Limits Unit

Power dissipation 0.8 W / TOTALPD

Range of storage temperature −55 to +150 °CTstg

∗ Mounted on a ceramic board

www.rohm.com ○c 2009 ROHM Co., Ltd. All rights reserved. 2009.03 - Rev.A 1/4

Page Summary Contents For ROHM ES6U3 Data Manual

Page 1 4V Drive Nch+SBD MOSFET ES6U3 Structure Dimensions (Unit : mm) Silicon N-channel MOSFET / WEMT6 Schottky barrier diode Features 1) Nch MOSFET and schottky barrier diode are put in WEMT6 package. 2) Hi...
Page 2 ES6U3 Data Sheet Electrical characteristics (Ta=25°C) &lt;MOSFET&gt; Parameter Symbol Min. Typ. Max. Unit Conditions Gate-source leakage IGSS ±10 µA VGS=±20V, VDS=0V Drain-source breakdown voltage V(B...
Page 3 ES6U3 Data Sheet IC IN IC IN IN ID IT p F -S IS on -S IS (o n) Electrical characteristics curves &lt; MOSFET &gt; Ta=25°C Ta=25°C Ta=25°C f=1MHz VDD=15V VDD=15V VGS=0V VGS=10V ID=1.4A RG=10Ω RG=10Ω Pu...
Page 4 ES6U3 Data Sheet &lt; Di &gt; EV ER SE EN : I µA pulsed pulsed Ta = 75℃ Ta = 25℃ Ta = 75℃ Ta = 25℃ Ta= - 25℃ Ta= - 25℃ REVERSE VOLTAGE : VR[V] FORWARD VOLTAGE : VF[V] Fig.1 Reverse Current vs. Reverse...
Page 5 Notice No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without not...

Manual Details

Brand ROHM
Pages 5
File Size 203.88 KB
Published June 05, 2026
23 views

Enter the captcha to get the download link:

captcha

Frequently Asked Questions

Can I use this MOSFET in life-critical applications like medical or aerospace equipment?

No, it is not designed for systems requiring an extremely high level of reliability; consultation is required for such special purposes.

What is the maximum Drain-Source Voltage (VDSS) rating for this component?

The absolute maximum drain-source voltage ($V_{DSS}$) allowed is 30 V.

Does the package include built-in protection or monitoring diodes?

Yes, it features both a body diode and an incorporated Schottky barrier diode ($D_i$) providing ESD protection.

What safety protocols must be implemented when integrating this product into custom equipment?

You must implement safety measures such as derating, redundancy, or fire-safe designs to prevent potential physical injury or damage.