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Fairchild Power MOSFETs and their Applications User Manual

Summary

Discover foundational knowledge on Power MOSFETs, advanced voltage-controlled switches designed for high-power circuit applications. This guide details MOSFET operation, comparing traditional lateral designs with superior vertical DMOS structures. Learn about key technical characteristics, including fast switching speeds, low gate power requirements, and structural considerations needed to optimize your device performance. Essential reading for engineers designing effective electrical switching systems.

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Application Note 558 Ralph Locher

Introduction to Power MOSFETs and their Applications INTRODUCTION

The Power MOSFETs that are available today perform the same function as Bipolar transistors except the former are voltage controlled in contrast to the current controlled Bipolar devices. Today MOSFETs owe their ever-increasing popularity to their high input impedance and to the fact that being a majority carrier device, they do not suffer from minority carrier storage time effects, ther- mal runaway, or second breakdown.

MOSFET OPERATION

An Understanding of the operation of MOSFETs can best be gleaned by the first considering the lateral N-channel MOSFET shown in Figure 1.

METAL (AL)

SOURCE GATE DRAIN

SILICON DIOXIDE (Si O )2

Si O2

INVERTED ZONE

P BODY SUBSTRATE

Figure 2. Lateral MOSFET Transistor Biased for

Figure 1. Lateral N-Channel MOSFET Cross-

Forward Current Conduction

Section

With no electrical bias applied to the gate G, no current can flow in either direction underneath the gate because there will always be a blocking PN junction. When the gate is forward biased with respect to the source S together with an applied drain-source voltage, as shown in Figure 2, the free hole carriers in the p-epitaxial layer are repelled away from the gate area creating a channel, which allows electrons to flow from the source to the drain. Note that since the holes have been repelled from the gate channel, the electrons are the “majority carriers” by default. This mode of operation is called “enhancement” but is easier to think of enhancement mode of operation as the device being “normally off”, i.e., the switch blocks the current until it receives a signal to turn on. The opposite is depletion mode, which is normally “on” device.

The advantages of the lateral MOSFET are: 1. Low gate signal power requirement. No gate current can flow into the gate after the small gate oxide capacitance has been charged. 2. Fast switching speeds because electrons can start to flow from drain to source as soon as the channel opens. The channel depth is proportional to the gate voltage and pinches closed as soon as the gate voltage is removed, so there is no storage time effect as occurs in transis tors.

Rev B, October 1998

Page Summary Contents For Fairchild Power MOSFETs and their Applications User Manual

Page 1 Application Note 558 Ralph Locher Introduction to Power MOSFETs and their Applications INTRODUCTION The Power MOSFETs that are available today perform the same function as Bipolar transistors except t...
Page 2 The major disadvantages are: 1. High resistance channels. In normal operation, the source is electrically connected to the substrate. With no gate bias, the depletion region extends out from the N+ dr...
Page 3 PARASITIC DIODE Figure 4a. DMOS Construction Figure 4c. Circuit Symbol Figure 4b. Parasitic Diode Showing Location of the Parasitic NPN Transistor diodes except for very low frequency applications. e....
Page 4 IT p F Figure 6a. MOSFET Capacitance Figure 6b. Switching Waveforms for Model for Power MOSFET Resistive Load Time interval t1<t<t2: The initial turn-on delay time td(ON) is due to the length of...
Page 5 Time interval t2<t<t3: Since VGS has now achieved the threshold value, the MOSFET begins to draw increasing load current and VDS decreases. CDG must not only discharge but its capacitance value ...
Page 6 IMPORTANCE OF THRESHOLD VOLTAGE Threshold voltage VGS(th) is the minimum gate voltage that initiates drain current flow. VGS(th) can be easily measured on a Tektronix 576 curve tracer by connecting th...
Page 7 The thermal model shows symbolically the locations for the reference points of junction tempera- ture, case temperature, sink temperature and ambient temperature. These temperature reference define th...
Page 8 Figure 12a. Junction Temperature Response to a Figure 12b. Transient Thermal Resistance Curve Step Pulse of Heating Power for NDS351N with confidence, it must represent the highest values ZθJC for eac...
Page 9 Figure 14a. Train of Power Pulses Figure 14b. Normalized r(t) for NDS351N To further simplify this calculation, the bracketed expression in equation (G) has been plotted for all Fairchild Semiconducto...
Page 10 Note that the safe area boundaries are only thermally limited and exhibit no derating for second breakdown. This shows that while the MOSFET transistor is very rugged, it may still be destroyed therma...
Page 11 Transconductance varies with operating conditions, starting at 0 for VGS<VGS(th) and peaking at a finite value when the device is fully saturated. It is very small in the ohmic region because the d...
Page 12 Capacitive load: Gate losses and blocking losses can usually be neglected. Using these equations, circuit de- signer is able to estimate the required heat sink. A final heat run in a controlled temper...
Page 13 Most frequently, switching power supply applications employ a pulse width modulator IC with an NPN transistor output stage. This output transistor is ON when the MOSFET should be ON, hence the type of...
Page 14 Opto-isolators may also be used to drive power MOSFETs but their long switching times make them suitable only for low frequency applications. Figure 26. Improved Performance at Turn-Off Figure 27. Emi...
Page 15 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ ISOP...

Manual Details

Brand Fairchild
Pages 15
File Size 200.61 KB
Published June 16, 2026
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Frequently Asked Questions

How are MOSFETs different from Bipolar transistors?

MOSFETs are voltage controlled, unlike current-controlled Bipolar devices, and they feature high input impedance.

What improvement does the vertical DMOS structure provide?

Vertical geometry allows for lower on-state resistance (Rds(on)) and faster switching than lateral MOSFETs.

What is the limitation of standard lateral MOSFETs?

The channel length cannot be shorter than the minimum depletion width required to support the device's rated voltage.

Are these components safe for life support applications?

No, they are not authorized for critical use in life support devices without express written approval from Fairchild Semiconductor Corporation.