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Fairchild FDB2552 FDP2552 User's Manual

Summary

Discover the FDB2552/FDP2552 N-Channel PowerTrench MOSFET, a high-performance switching device built for robust power management. This essential technical manual provides comprehensive details on electrical specifications, maximum ratings, thermal characteristics, and advanced switching curves necessary for reliable design implementation. It is engineered for professional applications including DC/DC Converters, Off-line UPS units, and complex Distributed Power Architectures (DPAs).

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Page 1 Text Content

February 2012

FDB2552 / FDP2552 N-Channel Power Trench® MOSFET 150V, 37A, 36mΩ Features Applications r DS(ON) = 32mΩ (Typ.), VGS = 10V, ID = 16A DC/DC Converters and Off-line UPS Qg(tot) = 39n C (Typ.), VGS = 10V Distributed Power Architectures and VRMs Low Miller Charge Primary Switch for 24V and 48V Systems Low QRR Body Diode High Voltage Synchronous Rectifier UIS Capability (Single Pulse and Repetitive Pulse)

Formerly developmental type 82869

DRAIN GATE

SOURCE(FLANGE) DRAIN GATE

SOURCE DRAIN (FLANGE)TO-220AB STO-263AB

FDP SERIES FDB SERIES

MOSFET Maximum Ratings TC = 25°C unless otherwise noted Symbol Parameter Ratings Units VDSS Drain to Source Voltage

VGS Gate to Source Voltage ±20 Drain Current

AContinuous (TC = 25o C, VGS = 10V)

ID Continuous (TC = 100o C, VGS = 10V) 26

Continuous (Tamb = 25o C, VGS = 10V) with RθJA = 43o C/W Pulsed Figure 4 EAS Single Pulse Avalanche Energy (Note 1) m J Power dissipation

Derate above 25o C 1.0 W/o C

TJ, TSTG Operating and Storage Temperature -55 to 175

Thermal Characteristics

RθJC Thermal Resistance Junction to Case TO-220, TO-263 1.0

RθJA Thermal Resistance Junction to Ambient TO-220, TO-263 (Note 2)

RθJA Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area

2012 Fairchild Semiconductor Corporation FDB2552 / FDP2552 Rev. C

Page Summary Contents For Fairchild FDB2552 FDP2552 User's Manual

Page 1 February 2012 FDB2552 / FDP2552 N-Channel Power Trench® MOSFET 150V, 37A, 36mΩ Features Applications r DS(ON) = 32mΩ (Typ.), VGS = 10V, ID = 16A DC/DC Converters and Off-line UPS Qg(tot) = 39n C (Typ....
Page 2 2552 / F Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDB2552 FDB2552 TO-263AB 330mm 24mm 800 units FDP2552 FDP2552 TO-220AB Tube N/A 50 units E...
Page 3 2552 / F Typical Characteristics TC = 25°C unless otherwise noted , N IZ IS IP IO LT IP IE TC, CASE TEMPERATURE (o C) TC, CASE TEMPERATURE (o C) Figure 1. Normalized Power Dissipation vs Figure 2. Max...
Page 4 2552 / F Typical Characteristics TC = 25°C unless otherwise noted IN IS TA (m Ω) PULSE DURATION = 80µs , D IN , D IN If R = 0 t AV = (L)(IAS)/(1.3*RATED BVDSS - VDD) 100µs If R ≠ 0 t AV = (L/R)ln[(IAS...
Page 5 2552 / F Typical Characteristics TC = 25°C unless otherwise noted , C PA IT IZ VGS = VDS, ID = 250µA ID = 250µA TJ, JUNCTION TEMPERATURE (o C) TJ, JUNCTION TEMPERATURE (o C) Figure 11. Normalized Gate...
Page 6 2552 / F Test Circuits and Waveforms BVDSS VARY t P TO OBTAIN IAS REQUIRED PEAK IAS RG 0V IAS 0.01Ω Figure 15. Unclamped Energy Test Circuit Figure 16. Unclamped Energy Waveforms VDD Qg(TOT) VGS = 10V...
Page 7 2552 / F Thermal Resistance vs. Mounting Pad Area The maximum rated junction temperature, TJM, and the thermal resistance of the heat dissipating path determines RθJA = 26.51+ 19.84/(0.262+Area) EQ.2 ...
Page 8 2552 / F PSPICE Electrical Model .SUBCKT FDP2552 2 1 3 ; rev May 2002 Ca 12 8 1e-9 Cb 15 14 1e-9 LDRAIN Cin 6 8 2.65e-9 DPLCAP DRAIN Dbody 7 5 Dbody MOD RLDRAIN RSLC1 Dbreak 5 11 Dbreak MOD DBREAK Dpl...
Page 9 2552 / F SABER Electrical Model REV May 2002 template FDP2552 n2,n1,n3 electrical n2,n1,n3 var i iscl dp..model dbodymod = (isl=2.6e-11,nl=1.09,rs=2.6e-3,trs1=3.0e-3,trs2=1.5e-6,cjo=1.9e-9,m=0.62,tt=5...
Page 10 2552 / F SPICE Thermal Model th JUNCTION REV 23 May 2002 FDP2552T CTHERM1 TH 6 1e-2 CTHERM2 6 5 1.5e-2 CTHERM3 5 4 2e-2 RTHERM1 CTHERM1 CTHERM4 4 3 2.1e-2 CTHERM5 3 2 2.2e-2 CTHERM6 2 TL 9e-2 RTHERM1 ...
Page 11 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive lis...