Texas Instruments - TPS2811 Data Sheet Manual
Summary
Optimize your power electronics designs with the TPS28xx series of high-speed dual MOSFET gate drivers. These robust components deliver up to 2A peak current into capacitive loads while minimizing supply consumption across an industrial temperature range (-40°C to 125°C). The product line offers flexible configurations, including regulated outputs and advanced input structures (AND/NAND gates), making it ideal for complex switching applications. This manual provides comprehensive technical documentation, detailed pin assignments, operational schematics, and model variations necessary for electrical engineers designing reliable power management systems.
Page 1 Text Content
SLVS132F − NOVEMBER 1995 − REVISED OCTOBER 2004
Industry-Standard Driver Replacement TPS2811, TPS2812, TPS2813 D, P, AND PW
PACKAGES
25-ns Max Rise/Fall Times and 40-ns Max
(TOP VIEW)
Propagation Delay − 1-n F Load, VCC = 14 V
2-A Peak Output Current, VCC = 14 V REG_IN REG_OUT 1IN 1OUT
5-µA Supply Current — Input High or Low
GND VCC
4-V to 14-V Supply-Voltage Range; Internal
2IN 2OUT
Regulator Extends Range to 40 V (TPS2811, TPS2812, TPS2813)
TPS2814 D, P, AND PW PACKAGES
−40°C to 125°C Ambient-Temperature
(TOP VIEW)
Operating Range
1IN1 GND
description
1IN2 1OUT
2IN1 VCC
The TPS28xx series of dual high-speed MOSFET
drivers are capable of delivering peak currents of 2 A 2IN2 2OUT
into highly capacitive loads. This performance is achieved with a design that inherently minimizes TPS2815 D, P, AND PW PACKAGES
shoot-through current and consumes an order of (TOP VIEW)
magnitude less supply current than competitive
1IN1 GND
products.
1IN2 1OUT
The TPS2811, TPS2812, and TPS2813 drivers include
2IN1 VCC
a regulator to allow operation with supply inputs
2IN2 2OUT
between 14 V and 40 V. The regulator output can power other circuitry, provided power dissipation does not exceed package limitations. When the regulator is not required, REG_IN and REG_OUT can be left disconnected or both can be connected to VCC or GND. The TPS2814 and the TPS2815 have 2-input gates that give the user greater flexibility in controlling the MOSFET. The TPS2814 has AND input gates with one inverting input. The TPS2815 has dual-input NAND gates. TPS281x series drivers, available in 8-pin PDIP, SOIC, and TSSOP packages operate over a ambient temperature range of −40°C to 125°C.
AVAILABLE OPTIONS
PACKAGED DEVICES
INTERNAL SMALL PLASTIC
TA LOGIC FUNCTION REGULATOR OUTLINE DIP TSSOP (PW)
Dual inverting drivers TPS2811D TPS2811P TPS2811PW Yes Dual noninverting drivers TPS2812D TPS2812P TPS2812PW
One inverting and one noninverting driver TPS2813D TPS2813P TPS2813PW
TPS2814D TPS2814P TPS2814PW
125°C Dual 2-input AND drivers, one inverting input on each driver
Dual 2-input NAND drivers
TPS2815D TPS2815P TPS2815PW
The D package is available taped and reeled. Add R suffix to device type (e.g., TPS2811DR). The PW package is only available left-end taped and reeled and is indicated by the R suffix on the device type (e.g., TPS2811PWR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Page Summary Contents For Texas Instruments - TPS2811 Data Sheet Manual
Manual Details
| Brand | Texas Instruments |
|---|---|
| Pages | 37 |
| File Size | 883.02 KB |
| Published | June 19, 2026 |
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Frequently Asked Questions
What is the peak output current capability of these drivers?
The TPS28xx drivers are capable of delivering peak currents of 2 A into highly capacitive loads.
Which models include a regulator for wide voltage range support?
The TPS2811, TPS2812, and TPS2813 series include a regulator that extends operation with supplies between 14V and 40V.
What is the ambient temperature operating range?
The components operate over an ambient temperature range of −40°C to 125°C.
How can the chip be mounted or assembled?
It may be mounted using conductive epoxy or a gold-silicon preform; thermal compression or ultrasonic bonding are also viable methods.