Texas Instruments SN74LVC1G79 Single Positive-Edge-Triggered D-Type Flip-Flop Owner's Manual

SN74LVC1G79

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

SCES220M – APRIL 1999 – REVISED JANUARY 2003

Available in the Texas Instruments DBV OR DCK PACKAGE (TOP VIEW)

Nano Star and Nano Free Packages Supports 5-V VCC Operation

Inputs Accept Voltages to 5.5 V

Max tpd of 4 ns at 3.3 V GND Low Power Consumption, 10-µA Max ICC

±24-m A Output Drive at 3.3 V YEA OR YZA PACKAGE (BOTTOM VIEW)

Ioff Supports Partial-Power-Down Mode Operation

Latch-Up Performance Exceeds 100 m A Per CLK JESD 78, Class II VCC ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)

description/ordering information This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the level at the output. Nano Star and Nano Free package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE TOP-SIDE

TA PACKAGE†

PART NUMBER MARKING‡

Nano Star

Reel of 3000 SN74LVC1G79YEAR

WCSP (DSBGA) – YEA

_ _ _ CR

Nano Free

Reel of 3000 SN74LVC1G79YZAR

WCSP (DSBGA) – YZA (Pb-free)

–40°C to 85°C

Reel of 3000 SN74LVC1G79DBVR

SOT (SOT 23) DBV C79 -

Reel of 250 SN74LVC1G79DBVT Reel of 3000 SN74LVC1G79DCKR

SOT (SC 70) DCK CR -

Reel of 250 SN74LVC1G79DCKT

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Nano Star and Nano Free are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Copyright  2003, Texas Instruments Incorporated

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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