Texas Instrument LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE DATA MANUALS AND USER GUIDES

查询LMV324S供应商 LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263K – AUGUST 1999 – REVISED JUNE 2003

2.7-V and 5-V Performance LMV324 D OR PW PACKAGE

(TOP VIEW)

Low-Power Shutdown Mode (LMV324S) No Crossover Distortion 4OUT

Low Supply Current: 1IN– 4IN– LMV321 130 µA Typ 1IN+ 4IN+

LMV358 210 µA Typ VCC+ GND LMV324 410 µA Typ 2IN+ 3IN+ LMV324S 410 µA Typ 2IN– 3IN–

Rail-to-Rail Output Swing 2OUT 3OUT

ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)

LMV324S D OR PW PACKAGE

– 1000-V Charged-Device Model (C101) (TOP VIEW)

description/ordering information

1OUT 4OUT 1IN– 4IN–

The LMV321, LMV358, and LMV324/LMV324S

1IN+ 4IN+

are single, dual, and quad low-voltage (2.7 V to

VCC GND

5.5 V), operational amplifiers with rail-to-rail

2IN+ 3IN+

output swing. The LMV324S is a variation of the

2IN– 3IN–

standard LMV324 that includes a power-saving

2OUT 3OUT

shutdown feature that reduces supply current to a

1/2 SHDN 3/4 SHDN

maximum of 5 µA per channel when the amplifiers are not needed.

LMV358 D, DGK, OR PW PACKAGE

The LMV321, LMV358, LMV324, and LMV324S

(TOP VIEW)

are the most cost-effective solutions for applications where low-voltage operation, space

1OUT VCC+

saving, and low price are needed. These

1IN– 2OUT

amplifiers were designed specifically for

1IN+ 2IN–

low-voltage (2.7 V to 5 V) operation, with

GND 2IN+

performance specifications meeting or exceeding the venerable LM358 and LM324 devices that operate from 5 V to 30 V. Additional features of the

LMV321 DBV OR DCK PACKAGE

LMV3xx devices are a common-mode input (TOP VIEW) voltage range that includes ground, 1-MHz

1IN+ VCC+

unity-gain bandwidth, and 1-V/µs slew rate.

The LMV321 is available in the ultra-small DCK

(SC-70) package, which is approximately IN– OUT

one-half the size of the DBV (SOT-23) package. This package saves space on printed circuit boards and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

Copyright  2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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