Intel Pentium III Processor Low Power Thermal Design Guide
Summary
This essential technical guide for the Pentium III Processor provides comprehensive instructions on critical thermal management and system design principles. It is designed for electrical engineers and hardware system designers requiring precise methods for calculating junction-to-ambient thermal resistance, determining necessary airflow, and implementing reliable cooling solutions. The manual details best practices for selecting heatsinks, fans, and various interface materials to ensure optimal processor performance in any enclosed system environment.
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Intel® Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000
Order Number: 273285-003
Page Summary Contents For Intel Pentium III Processor Low Power Thermal Design Guide
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Intel® Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003
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Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. ...
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Pentium® III Processor – Low Power Thermal Design Guide Contents 1.0 Introduction ..................................................................................................................5 2....
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Pentium® III Processor – Low Power Thermal Design Guide Tables Pentium® III Processor — Low Power Power Dissipation and Junction Temperature Thermal Diode Interface.......................................
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Pentium® III Processor – Low Power Thermal Design Guide 1.0 Introduction This document provides thermal performance information for the Intel® Pentium® III processor – Low Power with an integrated 256...
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Pentium® III Processor – Low Power Thermal Design Guide 3.0 Pentium® III Processor — Low Power Thermal Specifications The power dissipation and junction temperature specifications for the Pentium III ...
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Pentium® III Processor – Low Power Thermal Design Guide Table 2. Thermal Diode Interface Signal Name Ball Number Pin Description THERMDA AA15 Thermal diode anode THERMDC AB16 Thermal diode cathode Tab...
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Pentium® III Processor – Low Power Thermal Design Guide Table 4. Pentium® III Processor — Low Power Thermal Characterization Data θca or θja (°C/W) vs. Airflow (LFM) Dimensions Heatsink (Lx Wx H in mm...
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Pentium® III Processor – Low Power Thermal Design Guide 5.0 Determining Thermal Solution Design Parameters 5.1 Measuring Ambient Temperature Ambient temperature (TA) is the temperature of the undistri...
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Pentium® III Processor – Low Power Thermal Design Guide 5.4 Estimating Required Airflow Assuming worst-case conditions at 400 MHz (1.35 V): The junction temperature at the processor die surface is 100...
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Pentium® III Processor – Low Power Thermal Design Guide 6.0 Thermal Solution Design Considerations 6.1 Compact PCI Component Height Requirements The reference heatsink and fan solutions were designed ...
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Pentium® III Processor – Low Power Thermal Design Guide 6.2 Heatsink Solutions 6.2.1 Theory of Heatsink Operation A heatsink is simply a metal surface with pins or fins rising up off the surface. Heat...
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Pentium® III Processor – Low Power Thermal Design Guide 6.3.1 Theory of Fan Operation The typical fan involves a motor and a propeller. The motor can be either an AC induction motor or a brushless DC ...
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Pentium® III Processor – Low Power Thermal Design Guide The selection of the optimum thermal interface material between the device and heat sink must take into consideration the thermal performance, c...
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Pentium® III Processor – Low Power Thermal Design Guide 6.4.2 Elastomeric Materials Thermal elastomers provide an ideal interface material to complement the die-reference design requirement. The elast...
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Pentium® III Processor – Low Power Thermal Design Guide 6.4.3 Choosing an Interface Material Available interface materials include: Chomerics XTS454* Low Thermal Resistance Pads - Phase Change Materia...
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Pentium® III Processor – Low Power Thermal Design Guide 6.5 Attach Methods The heatsink attachment mechanism secures the heatsink to the board, provides adequate pressure to the heatsink for optimum t...
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Pentium® III Processor – Low Power Thermal Design Guide 8.0 Vendor List Table 7 provides a vendor list as a service to our customers for reference only. The inclusion of this list should not be consid...
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Pentium® III Processor – Low Power Thermal Design Guide Table 9. Vendor List (Sheet 2 of 2) Air Velocity Meter Supplier Kurz Instruments, Inc. 2411 Garden Road Monterey, CA 93940 Phone: 800-424-7356 F...
Manual Details
| Brand | Intel |
|---|---|
| Pages | 20 |
| File Size | 149.22 KB |
| Published | May 29, 2026 |
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Frequently Asked Questions
What is the purpose of this document?
It provides a Low Power Thermal Design Guide and specifications for the Intel Pentium III Processor.
How should overheating risks be managed using this processor?
Effective thermal management must consider ambient temperature, junction temperature, airflow estimation, heatsink design (theory/considerations), and fan solutions.
What types of materials can be used as interfaces between components?
Interface materials include Phase Change Materials, Elastomeric Materials (Thermal Grease, Tapes, Compound), and Thermal Foils.