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Fairchild FDD8778 FDU8778 Specifications Manual

Summary

The N O I T A T® FDD8778/FDU8778 is a high-efficiency N-Channel PowerTrench MOSFET engineered for demanding DC/DC converter applications. Ideal for powering professional components, this device excels in VRMs used in servers and desktop computer architectures due to its low on-resistance (max 14mΩ) and optimized gate charge for fast switching. This technical manual provides detailed specifications, covering electrical characteristics, thermal performance data, maximum operating ratings up to 175°C, and precise package information required for circuit design and reliable integration into power systems.

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FD 8778/FD 8778 N -C hannel Pow er Tren ch SFET

May 2006

tm FDD8778/FDU8778

N-Channel Power Trench® MOSFET 25V, 35A, 14mΩ Features General Description Max r DS(on) = 14.0mΩ at VGS = 10V, ID = 35A This N-Channel MOSFET has been designed specifically

to improve the overall efficiency of DC/DC converters using

Max r DS(on) = 21.0mΩ at VGS = 4.5V, ID = 33A

either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low

Low gate charge: Qg(TOT) = 12.6n C(Typ), VGS = 10V

r DS(on) and fast switching speed.

Low gate resistance

Ro HS compliant FR EE

Application

DC-DC for Desktop Computers and Servers

VRM for Intermediate Bus Architecture

TA TIO

I-PAK

Short Lead I-PAK

(TO-251AA)

MOSFET Maximum Ratings TC = 25°C unless otherwise noted Symbol Parameter Ratings Units VDS Drain to Source Voltage

VGS Gate to Source Voltage ±20 Drain Current -Continuous (Package Limited)

ID A -Continuous (Die Limited)

-Pulsed (Note 1) EAS Single Pulse Avalanche Energy (Note 2) m J PD Power Dissipation 39 TJ, TSTG Operating and Storage Temperature -55 to 175 °C

Thermal Characteristics

RθJC Thermal Resistance, Junction to Case TO-252,TO-251 3.8 °C/W RθJA Thermal Resistance, Junction to Ambient TO-252,TO-251 °C/W RθJA Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area 52 °C/W

Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDD8778 FDD8778 TO-252AA 13’’ 12mm 2500 units FDU8778 FDU8778 TO-251AA N/A(Tube) N/A 75 units FDU8778 FDU8778_F071 TO-251AA N/A(Tube) N/A 75 units

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com1 FDD8778/FDU8778 Rev. A

Page Summary Contents For Fairchild FDD8778 FDU8778 Specifications Manual

Page 1 FD 8778/FD 8778 N -C hannel Pow er Tren ch SFET May 2006 tm FDD8778/FDU8778 N-Channel Power Trench® MOSFET 25V, 35A, 14mΩ Features General Description Max r DS(on) = 14.0mΩ at VGS = 10V, ID = 35A This...
Page 2 FD 8778/FD 8778 N -C hannel Pow er Trench SFET Electrical Characteristics TJ = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source ...
Page 3 FD 8778/FD 8778 N -C hannel Pow er Trench SFET Typical Characteristics TJ = 25°C unless otherwise noted , D IN EN (A LI ZE , D IN EN (A IN -R ES IS TA 4.0 PULSE DURATION = 80µs PULSE DURATION = 80µs D...
Page 4 FD 8778/FD 8778 N -C hannel Pow er Trench SFET Typical Characteristics TJ = 25°C unless otherwise noted , D IN EN (A S, VA LA EN T( TE VO LT E( V) f = 1MHz VGS = 0V VDD = 10V VDD = 13V Coss VDD = 16V ...
Page 5 FD 8778/FD 8778 N -C hannel Pow er Trench SFET Typical Characteristics TJ = 25°C unless otherwise noted LI ZE ER IM PE E, DUTY CYCLE-DESCENDING ORDER SINGLE PULSE NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ...
Page 6 TRADEMARKS ® M FD 8778/FD 8778 N -C hannel Pow er Trench SFET The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an...

Manual Details

Brand Fairchild
Pages 6
File Size 358.35 KB
Published May 28, 2026
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Frequently Asked Questions

Can this MOSFET be used in life support devices?

No, Fairchild’s products are not authorized for use as critical components in life support unless you have express written approval.

What applications is the FDD8778/FDU8778 optimized for?

It is designed for improving DC/DC converters efficiency, including VRMs and use in desktop computers and servers.

How low can the component's drain-source on resistance be?

The maximum $R_{DS(on)}$ reported is 14.0 mΩ at V=10V and I=35A.

What thermal resistance values must I consider when cooling this device?

For TO-252, the junction to case ($ heta_{JC}$) is 3.8 °C/W, while the junction to ambient ($ heta_{JA}$) is 100 °C/W.