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www.fairchildsemi.com AN-9035 Smart Power Module Motion-SPM in Mini-DIP User’s Guide REV. B 7/19/05
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Table of Contents 1. Introduction ..........................................................................................................................
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 9. Power Loss and Dissipation...............................................................................................................................
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Introduction date, the Motion-SPM in Mini-DIP has the highest power density with 3A to 30A rated products built into a single 1.1 Introduction package ou...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 conduction and turn-off switching losses. They also IEC and etc. creepage and clearance spacing safety implement smooth switching performance without reg...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Figure 1.2 Junction-to-Case Thermal Resistance According to Current Rating of Motion-SPM in Mini-DIP Line-up 0.1KW~2.2KW rating in a single power circuit...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 2. Product Outline 2.1 Ordering Information Voltage Rating (x 10) CH: Option for Motion-SPM in Mini-DIP Ver.2 Current Rating S: Ceramic Base B: DBC Base ...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 2.3 Applications 2.4 Package Structure Motor drive for household electric appliances, such as air Figure 2.1 contains a picture and an internal structure...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 3. Outline and Pin Description 3.1 Outline Drawings VCC(L) VS(U) NW COM IN(VH) IN(UL) VCC(VH) IN(VL) VB(V) IN(WL) VS(V) VFO IN(WH) CFOD VCC(WH) CSC VB(W)...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Figure 3.1 Package Dimensions (SPM27BA) REV. B 7/19/05
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 3.2 Description of the Input and Output Pins output pins. The detailed functional descriptions are as follows: Table 3.1 defines the Motion-SPM in Mini-D...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Signal Input Pins Fault Out Duration Time Selection Pin Pin: IN(UL), IN(VL), IN(WL), IN(UH), IN(VH), IN(WH) Pin: CFOD These are pins to control the opera...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 3.3 Description of Dummy Pins Figure 3.2 defines the Motion-SPM in Mini-DIP dummy pins Figure 3.2 Description of Dummy Pins REV. B 7/19/05
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 4. Internal Circuit and Features power block and four drive ICs for control functions. The detailed features and integrated functions of Motion-SPM Figur...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 5. Absolute Maximum Ratings subtracting the surge voltage (50V or less, generated by the stray inductance between the Motion-SPM in Mini-DIP and 5.1 Elec...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE VPN(SURGE)@Tj=25o C VPN(SURGE)@ Hard off VPN(SURGE)@Tj=125o C VPN(SURGE)@ Soft off IC@ Soft off IC@Tj=125o C IC@ Hard off IC@Tj=25o C 100V/div, 100ns/div...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 6. Interface Circuit input logic is active-high and there are built-in pull-down resistors, external pull-up resistors are not needed. VFO 6.1 Input/Outp...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Level shift INUH,INVH,INWH Gate driver circuit 3.3kΩ(Typical) INUL,INVL,INWL Gate driver 3.3kΩ(Typical) Figure 6.2 Internal Structure of Signal Input Ter...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 6.2 General Interface Circuit Example Figure 6.3 shows a typical application circuit of interface schematic with control signals connected directly to a ...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 12. Excessively large inductance due to long wiring patterns signals. To decrease the pattern inductance, the wiring between the shunt resistor and Motio...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 6.4 External Gate Impedance RE(H) Switching Speed Control The Motion-SPM’s HVIC Vs pins are not connected internally to their respective IGBT emitters. T...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE threatening its stability. The higher the RE(H) increases, the moderately decreased. Since the bootstrap capacitor charges lower the HVIC voltage stress....
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 Considerations for RE(H) there should be an upper limit on RE(H). As for Motion-SPM in Mini-DIP, RE(H) should be restricted to 20Ω below. Figure When low...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 7. Function and Protection Circuit The voltage at the module’s COM terminal is different from that at the N power terminal by the drop across the sensing...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 7.2 Under-Voltage Protection a2: Normal operation: IGBT ON and carrying current. The LVIC has an under voltage lockout function to protect a3: Under volt...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Input Signal Protection RESET SET RESET Circuit State UVBSR Control UVBSD Supply Voltage Output Current High-level (no fault output) Fault Output Signal ...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 Lower arms control input Protection SET RESET circuit state Internal IGBT c4 Gate-Emitter Voltage c3 c2 Output Current SC Reference Voltage Sensing Volta...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE The internal protection circuit triggers off under SC protection level. The IC has an internal noise elimination condition by comparing the external shun...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 7.4 Fault Output Circuit Table 7.4 Fault-output Maximum Ratings Item Symbol Condition Rating Unit Fault Output Supply Voltage4 VFO Applied between VFO-CO...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 8. Bootstrap Circuit method described here. This method has the advantage of being simple and inexpensive. However, the duty cycle and 8.1 Operation of B...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 8.3 Selection of a Bootstrap Capacitor 8.5 Selection of a Bootstrap Resistance The bootstrap capacitance can be calculated by: A resistor RBS must be add...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 8.6 Charging and Discharging of the Bootstrap Conditions: Capacitor During PWM-Inverter Operation CBS = 22µF The bootstrap capacitor (CBS) charges throug...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 9. Power Loss and Dissipation voltage/current. Hence, in order to obtain the accurate switching loss, we should consider the DC-link voltage of 9.1 Power...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Switching Loss schemes. Therefore, depending on the switching frequency Different devices have different switching characteristics of fsw, the switching ...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 ff ti ve rr Io rm FSBS15CH60, Normalized ZΘjc of IGBT (℃/W) FSBS15CH60, Normalized ZΘjc of diode (℃/W) Time (s) Time (s) Figure. 9.2 Thermal Impedance Cu...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE 10. Package Silicon Grease Apply silicon grease between the SPM and the heat sink to 10.1 Heat Sink Mounting reduce the contact thermal resistance. Be su...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 nullifying the effect of the antistatic agent). Place the devices metallic material that allows rapid static discharge when a in special conductive trays...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE board thickness, and the effects that components have on one thermal and mechanical stresses that semiconductor devices another, makes it practically imp...
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MOTION-SPM IN MINI-DIP APPLICATION NOTE AN9035 10.4 Packaging Specifications Motion-SPM in Mini-DIP Configuration Packaging Description: All SPM parts are shipped normally in tube. The tube is made of...
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AN9035 MOTION-SPM IN MINI-DIP APPLICATION NOTE Notice for Safe Designs We are making every effort to improve the quality and reliability of our products. However, there are possibilities that semicond...