# A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Toshiba SSM3J01T Data Sheet

Summary

This advanced P-Channel MOSFET power switch, SSM3J01T, is designed for high-speed switching applications requiring low on-resistance and compact integration. This manual provides comprehensive technical specifications, detailing electrical characteristics, maximum ratings, and essential handling precautions necessary for proper circuit design. It is intended for engineers and designers building general electronic equipment, including industrial robotics, computing devices, and domestic appliances, ensuring optimal performance in demanding power management systems.

📄 Preview PAGE OF 5

Page 1 Text Content

查询SSM3J01T供应商

SSM3J01T

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type

SSM3J01T

Power Management Switch

Unit: mm

High Speed Switching Applications

Small Package Low on Resistance : Ron = 0.4 Ω (max) (@VGS = −4 V) : Ron = 0.6 Ω (max) (@VGS = −2.5 V) Low Gate Threshold Voltage

Maximum Ratings (Ta  25°C)

Characteristic Symbol Rating Unit

Drain-Source voltage VDS 30 V Gate-Source voltage VGSS 10 V

DC ID 1.7

Drain current IDP

Pulse 3.4

(Note2) PD

Drain power dissipation (Ta  25C) 1250 m W

(Note1)

Channel temperature Tch 150 C JEDEC ―

Storage temperature range Tstg 55~150 C

JEITA ―

Note 1: Mounted on FR4 board

TOSHIBA 2-3S1A

(25.4 mm  25.4 mm  1.6 t, Cu pad: 645 mm2, t  10 s)

Weight: 10 mg (typ.)

Note 2: The pulse width limited by max channel temperature.

Handling Precaution When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects that come into direct contact with devices should be made of anti-static materials. The Channel-to-Ambient thermal resistance Rth (ch-a) and the drain power dissipation PD vary according to the board material, board area, board thickness and pad area, and are also affected by the environment in which the product is used. When using this device, please take heat dissipation fully into account.

Marking Equivalent Circuit

Page Summary Contents For Toshiba SSM3J01T Data Sheet

Page 1 查询SSM3J01T供应商 SSM3J01T TOSHIBA Field Effect Transistor Silicon P Channel MOS Type SSM3J01T Power Management Switch Unit: mm High Speed Switching Applications Small Package Low on Resistance : Ron = 0....
Page 2 SSM3J01T Electrical Characteristics (Ta  25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS  10 V, VDS  0   1 A Drain-Source breakdown voltage V (BR) DS...
Page 3 SSM3J01T Fo rw ar tra ns fe r a dm itt an ce ra in -S ou rc on re si st an ce |Y fs S) (O ra in ur re nt (A ID – VDS ID – VGS Common Source Common Source Ta  25°C VDS  3 V Ta  100°C 25°C 0.2 VGS ...
Page 4 SSM3J01T Sw itc hi ng ti (n s) t – ID PD – Ta Common Source Mounted on FR4 board Tr an si en t t he rm al im pe da VDD  15 V nc (° /W t  10 s th 1.25 (25.4 mm  25.4 mm  1.6 t, VGS  0~2.5 V Cu P...
Page 5 SSM3J01T 000707EAARESTRICTIONS ON PRODUCT USE TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or f...

Manual Details

Brand Toshiba
Pages 5
File Size 157.26 KB
Published July 22, 2026
0 views

Enter the captcha to get the download link:

captcha

Frequently Asked Questions

What precautions must be taken when handling the device?

When handling individual devices, protect the environment from electrostatic electricity. Operators should wear anti-static clothing.

How does heat dissipation affect power ratings?

The drain power dissipation varies according to the board material, area, thickness, pad area, and the operating environment; always account for heat dissipation.

What is the recommended voltage for reliable switching operation?

Use a gate-source (GS) voltage of 2.5 V or higher to ensure proper turn-on characteristics.

What limits the maximum drain current during pulse operations?

The pulse width must be limited by the maximum channel temperature.