Texas Instruments CD4086B Data Sheet - Types Specifications
Summary
This technical manual provides comprehensive datasheets and mechanical specifications for the CD4086B series of logic integrated circuits. It is an essential resource for electronics engineers, offering detailed information on various packaging options (PDIP, SOIC, TSSOP) and electrical compliance standards like RoHS. Use this guide to select the optimal component package and ensure proper implementation when designing digital circuits that require reliable signal conditioning and robust performance features.
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Data sheet acquired from Harris Semiconductor SCHS061C – Revised September 2003
The CD4086B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
Page Summary Contents For Texas Instruments CD4086B Data Sheet - Types Specifications
Manual Details
| Brand | Texas Instruments |
|---|---|
| Pages | 12 |
| File Size | 532.33 KB |
| Published | June 06, 2026 |
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Frequently Asked Questions
What does the 'Green' designation mean regarding eco-friendly compliance?
It signifies that the device is Pb-Free (RoHS compatible) and contains no Bromine (Br) or Antimony (Sb) based flame retardants.
What determines which physical package type I should use?
The available suffixes define packages, such as PDIP for plastic dual-in-line or TSSOP for thin shrink small-outline packages.
How do I check the lead performance when soldering?
Check the device's specific Eco Plan column; 'Pb-Free (RoHS)' confirms compatibility with RoHS requirements.
What is the maximum allowable temperature related to reliability?
The Moisture Sensitivity Level (MSL) rating and Peak Temp. columns specify tolerance for various manufacturing processes.