ROHM HTSSOP-B20 User Guide
Summary
The HTSSOP-B20 is a 20-pin heat-sink thin-shrink small outline package by ROHM Co., Ltd. This design support document provides external package specifications, mechanical dimensions, and thermal characteristics for the HTSSOP-B20. The package is intended for ROHM semiconductors requiring enhanced thermal dissipation in a compact surface-mount footprint, with 3D viewing compatible with Adobe Reader 8.0 and later. It targets packaging engineers, PCB layout designers, and thermal management specialists integrating HTSSOP-B20 components into circuit designs.
Page 1 Text Content
Design Support Document
Package HTSSOP-B20 Images and figures are not scaled. The materials listed here represent the external package. Please inquire for data related to the internal structure.
A 3D-enabled browser is required to view this content. [Recommended Conditions] Compatible with Adobe Reader 8.0 and later
www.rohm.com
1/1 2010.06 - Rev. A
© 2010 ROHM Co., Ltd. All rights reserved.
Page Summary Contents For ROHM HTSSOP-B20 User Guide
Manual Details
| Brand | ROHM |
|---|---|
| Pages | 2 |
| File Size | 461.34 KB |
| Published | June 17, 2026 |
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Frequently Asked Questions
What software is needed to view this document?
A 3D-enabled browser is required. Adobe Reader 8.0 and later is recommended.
Can this product be used in medical instruments?
No, it is not designed for medical instruments or other high-reliability safety-critical systems.
What safety measures should be implemented when using the product?
Implement derating, redundancy, fire control and fail-safe designs to prevent injury or damage.