Philips Semiconductors SOT320-2 PCB Footprint Specification - User Guide
Summary
Philips Semiconductors PC board footprint specification for QFP128 SOT320-2 reflow soldering. Provides generic footprint pattern with precise millimeter dimensions for lead pitch, pad sizes, and land pattern layout. Specifies P1/P2 pitch, pad dimensions, solder resist coverage, and tolerance zones. For PCB layout engineers designing boards with QFP128 Philips semiconductor packages.
Page 1 Text Content
Philips Semiconductors PC board footprint
Footprint information for reflow soldering of QFP128 package SOT320-2
Gy Hy Ay By
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax Ay Bx By D1 D2 Gx Gy Hx Hy
SOT320-2_fp_reflow © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
PDF 21 December 2004 1 of 1
Page Summary Contents For Philips Semiconductors SOT320-2 PCB Footprint Specification - User Guide
Manual Details
| Brand | Philips |
|---|---|
| Pages | 1 |
| File Size | 11.38 KB |
| Published | July 04, 2026 |
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Frequently Asked Questions
What are the key dimensions for the QFP128 reflow footprint?
Pitch P1=0.800mm, P2=0.850mm. Body Ax=Ay=31.900mm, Bx=By=28.900mm.
What is the package code for this QFP128 footprint?
The package code is SOT320-2, according to the drawing.
What is the recommended soldering land width (C)?
The solder land width (C) is specified as 1.500 mm.