Dell EMC PowerEdge R6525 Technical Specifications
Summary
Technical specifications for Dell EMC PowerEdge R6525 server (Regulatory Model: E67S, March 2022). Provides chassis dimensions, weight, processor options, PSU specs, supported OSs, cooling fans, battery, and expansion slots. Covers physical space, power, and thermal requirements. Target audience: system architects and data center engineers planning Dell PowerEdge R6525 rack server deployments.
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Dell EMC Power Edge R6525 Technical Specifications
Regulatory Model: E67S Series Regulatory Type: E67S001 March 2022 Rev. A08
Page Summary Contents For Dell EMC PowerEdge R6525 Technical Specifications
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Dell EMC Power Edge R6525 Technical Specifications Regulatory Model: E67S Series Regulatory Type: E67S001 March 2022 Rev. A08
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Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of d...
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Contents Chapter 1: Technical specifications............................................................................................... Chassis dimensions.............................................
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Technical specifications The technical and environmental specifications of your system are outlined in this section. Topics: Chassis dimensions System weight Processor specifications PSU specification...
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Chassis dimensions Figure 1. Chassis dimensions Table 1. Power Edge R6525 chassis dimensions Drives Xa Xb Za Zb* Zc Eight drives 482.0 mm 434.0 mm 42.8 mm 700.7 mm 736.27 mm With bezel: 35.84 mm (1.4 ...
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System weight Table 2. Power Edge R6525 system weight System configuration Maximum weight (with all drives/SSDs) 4 x 3.5-inch 21.8 kg (48.06 lb) 8 x 2.5-inch 19.2 kg (42.33 lb) 10 x 2.5-inch 21.8 kg (...
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Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi For more information, see www.dell.com/ossupport. Cooling fan specifications The Power Edge R652...
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Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known Label Label image as color Figure 3. High performance fan Technical specifications
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Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known Label Label image as color Figure 4. High performance (Silver grade) fan NOTE: New cooling fans comes with the High Per...
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Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known Label Label image as color Figure 5. High performance fan Technical specifications
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Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known Label Label image as color Figure 6. High performance (Gold grade) fan NOTE: You can distinguish between the High-perfo...
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Table 6. Expansion card slots supported on the system board PCIe slot Risers Riser width PCIe slot height PCIe slot length Slot width Slot 1 R2a (Riser 2) x32 PCIe Low profile Half length x16 Slot 1 R...
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Table 9. Power Edge R6525 system controller cards Internal controllers External controllers Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs Boot Optimized Storage Subsystem (BOSS-S2): ...
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NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as exte...
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Table 13. Supported front video resolution options (continued) Resolution Refresh rate (Hz) Color depth (bits) 1360 x 768 8, 16, 32 1440 x 900 8, 16, 32 1600 x 900 8, 16, 32 1600 x 1200 8, 16, 32 1680...
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Table 16. Operational climatic range category A3 (continued) Temperature Specifications Humidity percent ranges (non-condensing at all 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) t...
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128 GB or greater capacity LRDIMMs are not supported. Two PSUs are required in redundant mode, however PSU failure is not supported. Non-Dell qualified peripheral cards and/or peripheral cards greater...
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Table 21. Thermal restriction matrix (continued) Configu 4 x 3.5-inch 8 x 2.5- 10 x 2.5-inch SAS 10 x 2.5-inch NVMe ration inch Rear 3 LP/ 2 Rear 2 x Rear 2 x 3 LP/ 2 3 LP/ 2 FH Rear 2 x Rear 2 x 3 LP...
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Table 22. Liquid cooling thermal restriction matrix (continued) Configuration 4 x 3.5-inch 8 x 2.5- 10 x 2.5-inch SAS 10 x 2.5-inch NVMe Rear storage 3 LP/ 2 Rear 2 x Rear 2 x 3 LP/ 2 3 LP/ 2 Rear 2 x...
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Table 24. Processor support matrix (continued) Processor TDP (W) c TDP Max Cores Heat sink Fan type Fan type Support A3 Support A4 (W) (HSK) type (x4/x8) (x10) L-type HSK HPR (silver) HPR (gold) No No...
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Table 24. Processor support matrix (continued) Processor TDP (W) c TDP Max Cores Heat sink Fan type Fan type Support A3 Support A4 (W) (HSK) type (x4/x8) (x10) STD HSK STD fan HPR (gold) Yes Yes STD H...
Manual Details
| Brand | Dell |
|---|---|
| Pages | 21 |
| File Size | 2.32 MB |
| Published | July 01, 2026 |
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Frequently Asked Questions
What is the maximum ambient temperature for T4 GPU or 280 W CPU?
The maximum supported ambient temperature is 30°C.
Which types of processor slots require DIMM blanks when a 280 W CPU is installed?
DIMM blanks are required on empty slots if a 280 W CPU is installed.
What specifications detail the system's physical limitations and dimensions?
The section 'Environmental specifications' covers chassis dimensions and weight.
What connector types are specified for data connectivity?
Specifications include USB ports, NIC ports, Serial connectors, and VGA ports.