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AMD Am28F010 1 Megabit (128 K x 8-Bit) CMOS 12.0 Volt Bulk Erase Flash Memory User Manual

Summary

The Am28F010 is a high-performance 1 Megabit Flash memory semiconductor, perfect for embedding reliable, non-volatile random access data storage in demanding electronic systems. This guide provides comprehensive technical specifications, detailing advanced chip-erase/programming algorithms and low-power consumption features for ease of design integration. It is essential reading for electrical engineers and hardware developers requiring robust, fast-access memory solutions compatible with modern microprocessors and embedded control applications.

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FINAL

Am28F010 1 Megabit (128 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory DISTINCTIVE CHARACTERISTICS High performance Flasherase™ Electrical Bulk Chip-Erase 70 ns maximum access time One second typical chip-erase CMOS Low power consumption Flashrite™ Programming 30 m A maximum active current 10 µs typical byte-program 100 µA maximum standby current Two seconds typical chip program No data retention power consumption

Command register architecture for microprocessor/microcontroller compatible

Compatible with JEDEC-standard byte-wide

write interface

32-Pin EPROM pinouts

32-pin PDIP On-chip address and data latches

32-pin PLCC

Advanced CMOS flash memory technology

32-pin TSOP

Low cost single transistor memory cell

10,000 write/erase cycles minimum

Automatic write/erase pulse stop timer

Write and erase voltage 12.0 V ±5% Latch-up protected to 100 m A from –1 V to VCC +1 V

GENERAL DESCRIPTION The Am28F010 is a 1 Megabit Flash memory orga- AMD’s Flash technology reliably stores memory con- nized as 128 Kbytes of 8 bits each. AMD’s Flash mem- tents even after 10,000 erase and program cycles. The ories offer the most cost-effective and reliable read/ AMD cell is designed to optimize the erase and pro- write non-volati le random access memory. The gramming mechanisms. In addition, the combination of Am28F010 is packaged in 32-pin PDIP, PLCC, and advanced tunnel oxide processing and low internal TSOP versions. It is designed to be reprogrammed electric fields for erase and programming operations and erased in-system or in standard EPROM pro- produces reliable cycling. The Am28F010 uses a grammers. The Am28F010 is erased when shipped 12.0V 5% VPP high voltage input to perform the

from the factory. Flasherase and Flashrite algorithms. The standard Am28F010 offers access times as fast as The highest degree of latch-up protection is achieved 70 ns, allowing operation of high-speed microproces- with AMD’s proprietary non-epi process. Latch-up pro- sors without wait states. To eliminate bus contention, tection is provided for stresses up to 100 milliamps on the Am28F010 has separate chip enable (CE#) and address and data pins from –1 V to VCC +1 V.

output enable (OE#) controls.

The Am28F010 is byte programmable using 10 ms pro- AMD’s Flash memories augment EPROM functionality gramming pulses in accordance with AMD’s Flashrite with in-circuit electrical erasure and programming. The programming algorithm. The typical room temperature Am28F010 uses a command register to manage this programming time of the Am28F010 is two seconds. functionality, while maintaining a JEDEC Flash Stan- The entire chip is bulk erased using 10 ms erase pulses dard 32-pin pinout. The command register allows for according to AMD’s Flasherase alrogithm. Typical era- 100% TTL level control inputs and fixed power supply sure at room temperature is accomplished in less than levels during erase and programming, while maintain- one second. The windowed package and the 15–20

ing maximum EPROM compatibility.

Publication# 11559 Rev: H Amendment/+2 Issue Date: January 1998

Page Summary Contents For AMD Am28F010 1 Megabit (128 K x 8-Bit) CMOS 12.0 Volt Bulk Erase Flash Memory User Manual

Page 1 FINAL Am28F010 1 Megabit (128 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory DISTINCTIVE CHARACTERISTICS High performance Flasherase™ Electrical Bulk Chip-Erase 70 ns maximum access time One secon...
Page 2 minutes required for EPROM erasure using ultra-violet ing edge of WE# or CE# whichever occurs first. To light are eliminated. simplify the following discussion, the WE# pin is used as the write cycle ...
Page 3 CONNECTION DIAGRAMS PDIP PLCC VPP VCC A16 WE# (W#) A15 NC A12 A14 A7 A14 A2 OE# (G#) A3 OE# (G#) A0 CE# (E#) A1 CE# (E#) DQ0 DQ7 A0 DQ7 DQ0 DQ6 DQ1 DQ5 DQ2 DQ4 VSS DQ3 Note: Pin 1 is marked for orient...
Page 4 CONNECTION DIAGRAMS (continued) A11 OE# A9 A10 A8 CE# A13 D7 A14 D6 NC D5 WE# D4 VCC D3 NC VSS 32-Pin TSOP—Standard Pinout OE# A11 A10 A9 CE# A8 D7 A13 D6 A14 D5 NC D4 WE# D3 VCC VSS NC D2 A16 D1 A15 ...
Page 5 ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of: AM28F010 -70 OP...
Page 6 PIN DESCRIPTION VCC A0–A16 Power supply for device operation. (5.0 V ± 5% or 10%) Address Inputs for memory locations. Internal latches VPP hold addresses during write cycles. Program voltage input. V...
Page 7 BASIC PRINCIPLES The device uses 100% TTL-level control inputs to formation must be supplied with the Erase-verify manage the command register. Erase and repro- command. This command verifies the marg...
Page 8 VCC < VLKO (see DC Characteristics section for Logical Inhibit voltages). When VCC < VLKO, the command register is Writing is inhibited by holding any one of OE# = VIL, CE# disabled, al l intern...
Page 9 READ ONLY MODE When VPP is less than VCC + 2 V, the command register Auto Select is inactive. The device can either read array or autose- Flash memories can be programmed in-system or in a lect data, ...
Page 10 ERASE, PROGRAM, AND READ MODE When VPP is equal to 12.0 V ± 5%, the command reg- Refer to AC Write Characteristics and the Erase/Pro- ister is active. All functions are available. That is, the grammin...
Page 11 FLASHERASE ERASE SEQUENCE Erase Setup ated by writing A0h to the register. The byte address to be verified must be supplied with the command. Ad- Erase Setup is the first of a two-cycle erase command....
Page 12 FLASHERASE ELECTRICAL ERASE ALGORITHM This Flash memory device erases the entire array in algorithm. Erasure then continues with an initial erase parallel. The erase time depends on VPP, temperature, ...
Page 13 Start Yes Data = 00h Program All Bytes to 00h Apply VPPH Address = 00h PLSCNT = 0 Write Erase Setup Command Write Erase Command Time out 10 ms Write Erase Verify Time out 6 µs Read Data from Device In...
Page 14 Section Addresses Data 20h20h A0h Bus Cycle Write Write Time-out Write Time-out Read Standby Compare Command 20h 20h N/A A0h N/A N/A Proceed per Erase Erase Erase- Transition Erase Function Erase Eras...
Page 15 the Erase-verify command (section D). Addresses are location fail to verify to FFh data, erase the device latched on the falling edge of the WE# pulse. again. Repeat sections A thru F. Resume verifica...
Page 16 Start Apply VPPH PLSCNT = 0 Write Program Setup Command Write Program Command (A/D) Time out 10 µs Write Program Verify Command Time out 6 µs Read Data from Device Verify Byte Increment PLSCNT PLSCNT ...
Page 17 Table 5. Flashrite Programming Algorithm Bus Operations Command Comments Wait for VPP Ramp to VPPH (Note 1) Standby Initialize Pulse counter Program Setup Data = 40h Write Program Valid Address/Data S...
Page 18 Section Addresses Data Data Data A0h In20h Out Bus Cycle Write Write Time-out Write Time-out Read Standby Program C0h Compare Command 40h Address, N/A (Stops N/A N/A Program Data Program) Program Comm...
Page 19 routine (6 µs duration) must be executed to allow for Parallel Device Erasure generation of internal voltages for margin checking and Many applications will use more than one Flash read operations (se...
Page 20 Auto Select Command AMD’s Flash memories are designed for use in applica- The operation is initiated by writing 80h or 90h into the tions where the local CPU alters memory contents. Ac- command regist...
Page 21 ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Storage Temperature Commercial (C) Devices Plastic Packages . . . . . . . . . . . . . . . –65°C to +125°C Ambient Temperature (TA). . . . . . . . . . . .0°C t...
Page 22 MAXIMUM OVERSHOOT 20 ns 20 ns 20 ns Maximum Negative Input Overshoot 20 ns VCC + 2.0 V VCC + 0.5 V 20 ns 20 ns Maximum Positive Input Overshoot 20 ns VCC + 0.5 V 20 ns 20 ns Maximum VPP Overshoot Am28...
Page 23 DC CHARACTERISTICS over operating range unless otherwise specified TTL/NMOS Compatible Parameter Symbol Parameter Description Test Conditions Min Typ Max Unit ILI Input Leakage Current VCC = VCC Max, ...
Page 24 DC CHARACTERISTICS CMOS Compatible Parameter Symbol Parameter Description Test Conditions Min Typ Max Unit ILI Input Leakage Current VCC = VCC Max, VIN = VCC or VSS ±1.0 µA ILO Output Leakage Current ...
Page 25 ct iv in Frequency in MHz Figure 5. Am28F010—Average ICC Active vs. Frequency VCC = 5.5 V, Addressing Pattern = Minmax Data Pattern = Checkerboar TEST CONDITIONS Table 6. Test Specifications Test Cond...
Page 26 SWITCHING TEST WAVEFORMS Test Points 1.5 V 1.5 VTest Points Input Output Input Output AC Testing (all speed options except -70): Inputs are driven at AC Testing for -70 devices: Inputs are driven at 3...
Page 27 AC CHARACTERISTICS—Write/Erase/Program Operations Parameter Symbols Am28F010 Speed Options JEDEC Standard Description -70 -90 -120 -150 -200 Unit t AVAV t WC Write Cycle Time (Note 4) Min ns t AVWL t ...
Page 28 KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS Steady Changing from H to L Changing from L to H Don’t Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is High Impedanc...
Page 29 SWITCHING WAVEFORMS Power-up, Setup Erase Erase Erase-Verify Erase Standby, Standby Command Command Erasure Command Verification Power-down Addresses t AVAV (t WC) t AVAV (t RC) t AVWL (t AS) t WLAX (...
Page 30 SWITCHING WAVEFORMS Program Command Power-up, Setup Program Latch Address Verify Programming Standby, Standby Command and Data Programming Command Verification Power-down Addresses t AVAV (t WC) t AVA...
Page 31 ERASE AND PROGRAMMING PERFORMANCE Limits Typ Max Parameter (Note 1) (Note 2) Unit Comments Min Chip Erase Time sec Excludes 00h programming prior to erasure Chip Programming Time 12.5 sec Excludes sys...
Page 32 PHYSICAL DIMENSIONS PD032—32-Pin Plastic DIP (measured in inches) Pin 1 I.D. .065 .005 MIN 16-038-S_AG SEATING PLANE PD 032 .015 EC75 .110 .016 5-28-97 lv PL032—32-Pin Plastic Leaded Chip Carrier (mea...
Page 33 PHYSICAL DIMENSIONS TS032—32-Pin Standard Thin Small Outline Package (measured in millimeters) Pin 1 I.D. 0.50 BSC 16-038-TSOP-2 TS 032 MAX DA95 3-25-97 lv Am28F010
Page 34 PHYSICAL DIMENSIONS TSR032—32-Pin Reversed Thin Small Outline Package (measured in millimeters) Pin 1 I.D. 0.50 BSC 0.08 16-038-TSOP-2 TSR032 3-25-97 lv Am28F010
Page 35 REVISION SUMMARY FOR AM28F010 AC Characteristics: Write/Erase/Program Operations: Added the -70 col- Revision G+1 umn. Deleted -95 and -250 speed options. Changed Distinctive Characteristics: speed op...

Manual Details

Brand AMD
Pages 35
File Size 464.38 KB
Published May 14, 2026
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Frequently Asked Questions

What is the minimum write/erase cycle life for this memory chip?

The Am28F010 offers a minimum of 10,000 write/erase cycles.

How does the device handle high electrical stress during operation?

It includes latch-up protection for stresses up to 100 mA from –1 V to V +1 V, and separate CE# and OE# controls are provided.

What is the fastest data access time available?

The fastest access time listed is 70 ns for all primary signal inputs (CE#, OE#) and the data bus.

Are there different physical packages available for this memory chip?

Yes, it comes in 32-pin PDIP, PLCC, or TSOP versions.