Philips Semiconductors PC Board Footprint SOT687-1 FOOTPRINT (REFLOW SOLDERING) User Manual
Summary
This technical documentation provides comprehensive design specifications for a SOT687-1 surface mount component footprint, crucial for advanced PCB layout design. The manual details precise dimensions, copper trace patterns, solder land configurations, and recommended clearances necessary for reliable reflow soldering processes. It is essential reference material for electronics engineers and hardware designers creating boards that incorporate high-density semiconductor components using modern SMT techniques.
Page 1 Text Content
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Philips Semiconductors PC board footprint
SOT687-1 FOOTPRINT (REFLOW SOLDERING)
handbook, full pagewidth 1 SP
(8×) 0.4 SP 0.4 SP0.6 Cu
0.28 Cu (68×)
1 SP (8×)
11.15 OA 7.6 Cu 8.9 Cu 10.8 Cu
4.1 0.6 Cu
0.5 SP
0.4 SP (2×) (4×)
0.9 SP (10×)
solder lands
8.63 OA (4×) MGW820
Cu pattern
clearance
solder paste
occupied area
Dimensions in mm.
Page Summary Contents For Philips Semiconductors PC Board Footprint SOT687-1 FOOTPRINT (REFLOW SOLDERING) User Manual
Manual Details
| Brand | Philips |
|---|---|
| Pages | 1 |
| File Size | 21.28 KB |
| Published | July 10, 2026 |
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Frequently Asked Questions
What type of board footprint is listed?
It is the SOT687-1 FOOTPRINT for reflow soldering.
What are the dimensions provided in millimeters (mm)?
The manual provides various linear and spacing measurements, including 4.1 mm, 8.9 mm, and 10.8 mm.
What copper layers are detailed?
The footprint design includes multiple copper sections and patterns (e.g., 0.4 SP, 0.2 Cu).
What is the recommended solder paste occupation area?
Solder lands have a specific pattern with dimensions like 10· OA (4·) MGW820.