Intel White Paper Hot-Socketing & Power-Sequencing Feature & Testing for Intel® FPGA Devices
Summary
Enhance system reliability with advanced hot-socketing and power-sequencing capabilities for Altera FPGA and CPLD devices. This comprehensive white paper is essential reading for system designers building high-availability, multi-voltage systems. It details the implementation, technical specifications, and rigorous testing procedures required to safely insert or remove boards during live operation without downtime. Master hassle-free, drop-in solutions while ensuring ideal power sequencing for your digital logic designs.
Page 1 Text Content
White Paper
Hot-Socketing & Power-Sequencing Feature & Testing
for Altera Devices
Introduction
Hot socketing and power-sequence-protection are important for high-availability systems and multi-voltage systems. Hot socketing refers to the ability to insert or remove a board into or out of a system during system operation without causing undesirable effects to the host system or the cards themselves. It is often also referred to as hot swapping or hot plug-in. This feature also allows the PLDs to resume normal operation regardless of the power sequence.
A programmable logic device (PLD) capable of hot socketing must meet the following criteria.
The device can be driven before power-up without any damage to the device itself. The device does not drive out before or during power-up. External input signals to the device I/O pins do not power the device’s VCCIO or VCCINT power supplies through internal paths of the device.
Altera has a robust design and full support for hot socketing and power sequencing in its advanced FPGA and CPLD devices. This white paper defines the hot socketing feature for FPGA and CPLD devices, discusses their implementations in silicon, and provides characterization work that demonstrates that Altera devices are hot socketable.
This document contains the following sections:
Altera Hot-Socketing and Power-Sequencing Feature Overview Hot-Socketing and Power-Sequencing Feature in FPGA Devices Hot-Socketing and Power-Sequencing Feature in CPLD Devices Hot Socketing and Power-Sequencing Testing for Altera FPGA Devices Hot Socketing and Power-Sequencing Testing for Altera CPLD Devices Conclusion Altera Hot-Socketing & Power-Sequencing Feature Overview
The hot-socketing and power-sequencing feature for Altera FPGA and CPLD devices offers:
No-hassle, drop-in solution No external components or board manipulation are necessary to support hot socketing Supported for any power-up sequence I/O buffers that are non-intrusive to system buses during hot insertion
Hot-Socketing & Power-Sequencing Feature in FPGA Devices
Altera is the only FPGA vendor offering hot-socketing and power-sequencing support for FPGAs manufactured on a 0.13-μm process. The Stratix, Stratix GX, and Cyclone FPGA families are all based on the 0.13-μm process and each family is designed and has been tested to support hot socketing. Altera will also support the hot socketing feature on devices manufactured on the 90-nm process technology.
May 2006, ver. 1.1 1
WP-HTSCKTNG-1.1
Page Summary Contents For Intel White Paper Hot-Socketing & Power-Sequencing Feature & Testing for Intel® FPGA Devices
Manual Details
| Brand | Intel |
|---|---|
| Pages | 22 |
| File Size | 323.99 KB |
| Published | June 05, 2026 |
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Frequently Asked Questions
What does hot-socketing involve?
It's the ability to insert or remove a board during system operation without undesired effects.
Which FPGA families support hot socketing on the 0.13-μm process?
Stratix, Stratix GX, and Cyclone are designed and tested to support hot socketing.
What is the DC specification for general I/O pins during hot socketing?
The hot-socketing DC specification is |I| < 300 μA.
How must signals be handled relative to device power-up or power-down events?
You can drive signals into the device before or during power-up/power-down without damaging it.
What capacity limits are provided for I/O pins and clock pins during hot socketing?
I/O pin capacitance must be less than 15 pF, and clock pin capacitance must be less than 20 pF.