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Intel White Paper Hot-Socketing & Power-Sequencing Feature & Testing for Intel® FPGA Devices

Summary

Enhance system reliability with advanced hot-socketing and power-sequencing capabilities for Altera FPGA and CPLD devices. This comprehensive white paper is essential reading for system designers building high-availability, multi-voltage systems. It details the implementation, technical specifications, and rigorous testing procedures required to safely insert or remove boards during live operation without downtime. Master hassle-free, drop-in solutions while ensuring ideal power sequencing for your digital logic designs.

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White Paper

Hot-Socketing & Power-Sequencing Feature & Testing

for Altera Devices

Introduction

Hot socketing and power-sequence-protection are important for high-availability systems and multi-voltage systems. Hot socketing refers to the ability to insert or remove a board into or out of a system during system operation without causing undesirable effects to the host system or the cards themselves. It is often also referred to as hot swapping or hot plug-in. This feature also allows the PLDs to resume normal operation regardless of the power sequence.

A programmable logic device (PLD) capable of hot socketing must meet the following criteria.

The device can be driven before power-up without any damage to the device itself. The device does not drive out before or during power-up. External input signals to the device I/O pins do not power the device’s VCCIO or VCCINT power supplies through internal paths of the device.

Altera has a robust design and full support for hot socketing and power sequencing in its advanced FPGA and CPLD devices. This white paper defines the hot socketing feature for FPGA and CPLD devices, discusses their implementations in silicon, and provides characterization work that demonstrates that Altera devices are hot socketable.

This document contains the following sections:

Altera Hot-Socketing and Power-Sequencing Feature Overview Hot-Socketing and Power-Sequencing Feature in FPGA Devices Hot-Socketing and Power-Sequencing Feature in CPLD Devices Hot Socketing and Power-Sequencing Testing for Altera FPGA Devices Hot Socketing and Power-Sequencing Testing for Altera CPLD Devices Conclusion Altera Hot-Socketing & Power-Sequencing Feature Overview

The hot-socketing and power-sequencing feature for Altera FPGA and CPLD devices offers:

No-hassle, drop-in solution No external components or board manipulation are necessary to support hot socketing Supported for any power-up sequence I/O buffers that are non-intrusive to system buses during hot insertion

Hot-Socketing & Power-Sequencing Feature in FPGA Devices

Altera is the only FPGA vendor offering hot-socketing and power-sequencing support for FPGAs manufactured on a 0.13-μm process. The Stratix, Stratix GX, and Cyclone FPGA families are all based on the 0.13-μm process and each family is designed and has been tested to support hot socketing. Altera will also support the hot socketing feature on devices manufactured on the 90-nm process technology.

May 2006, ver. 1.1 1

WP-HTSCKTNG-1.1

Page Summary Contents For Intel White Paper Hot-Socketing & Power-Sequencing Feature & Testing for Intel® FPGA Devices

Page 1 White Paper Hot-Socketing & Power-Sequencing Feature & Testing for Altera Devices Introduction Hot socketing and power-sequence-protection are important for high-availability systems and multi...
Page 2 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Hot-Socketing & Power-Sequencing Specification for FPGA Devices Altera’s 0.13-μm FPGA devices support hot...
Page 3 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Each I/O pin has the circuitry shown in Figure 1. Figure 1. Hot Socketing Circuit Block Diagram for FPGA Devi...
Page 4 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 2. Transistor Level Diagram of FPGA Device I/O Buffers VPAD The Larger of Ensures 3-V Core Signal OR V...
Page 5 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Figure 3. ESD Protection During Positive Voltage Zap Source Drain P-Substrate Drain Gate N+ Source GND GND No...
Page 6 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 4. ESD Protection During Negative Voltage Zap Source Gate N+ Drain P-Substrate Drain NMOS N+ Source Ho...
Page 7 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Hot-Socketing & Power-Sequencing Feature Implementation in CPLD Devices Each I/O pin has the circuitry sh...
Page 8 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 6. Transistor Level Diagram of CPLD Device I/O Buffers VPAD The Larger of Ensures 5-V Core Signal OR V...
Page 9 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Test Conditions The conditions used for the test are: Temperature: -40° C, 130° C VCCINT = 0 to 1.575 V VCCIO...
Page 10 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Test Results Table 1 shows the tested combinations and test results for the Stratix and Stratix GX I/O pins (...
Page 11 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Table 2 shows the tested combinations and test results for the Cyclone devices. A passing result indicates th...
Page 12 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 9. Stratix GX Test Setup for Hot Socketing Test Cases The following cases were tested with the transmi...
Page 13 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Figure 10. Combination of TXp Hot Socket Measurement with Low VCCIO & Low TXn (1), (2) Combination 1 Comb...
Page 14 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 11. Combination of TXp Hot Socket Measurement with Low VCCIO & High TXn (1), (2) Combination 1 Com...
Page 15 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Figure 12. Combination of TXp Hot Socket Measurement with High VCCIO & Low TXn (1), (2) Combination 1 Com...
Page 16 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 13. Combination of TXp Hot Socket Measurement with High VCCIO & High TXn (1), (2) Combination 1 Co...
Page 17 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Test Results Table 3 shows the test results. Table 3. Stratix GX High-Speed Transceiver I/O Pin Hot-Socketing...
Page 18 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 14. Test Setup for CPLD Devices IIOPIN VCCINT VSIGNAL VOUT 10 Ω VCCIO Signal Input VSIGNAL Channel 1 C...
Page 19 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Figure 16. Case 2, VSIGNAL (3 V) => VCCIO (3 or 0 V) => VCCINT (ramp) Notes (1), (2) In All Conditions,...
Page 20 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 17. Case3: VSIGNAL (3 V) => VCCINT/VCCIO (ramped simultaneously) Notes (1), (2) With a Tri-Stated D...
Page 21 Altera Corporation Altera Device Hot-Socketing & Power Sequencing Features White Paper Appendix Figures 18 and 19 show examples of passing and failing scope shots, respectively. Figure 18. Example...
Page 22 Altera Device Hot-Socketing & Power Sequencing Features White Paper Altera Corporation Figure 19. Example Scope Shot of a Failing Waveform The Voltage Drop Means the I/O Pin is Drawing Current VCC...

Manual Details

Brand Intel
Pages 22
File Size 323.99 KB
Published June 05, 2026
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Frequently Asked Questions

What does hot-socketing involve?

It's the ability to insert or remove a board during system operation without undesired effects.

Which FPGA families support hot socketing on the 0.13-μm process?

Stratix, Stratix GX, and Cyclone are designed and tested to support hot socketing.

What is the DC specification for general I/O pins during hot socketing?

The hot-socketing DC specification is |I| < 300 μA.

How must signals be handled relative to device power-up or power-down events?

You can drive signals into the device before or during power-up/power-down without damaging it.

What capacity limits are provided for I/O pins and clock pins during hot socketing?

I/O pin capacitance must be less than 15 pF, and clock pin capacitance must be less than 20 pF.