Fairchild MM74HCT240 MM74HCT244 Octal 3-State Buffer Data Manual
Summary
These high-speed octal 3-State buffers provide essential signal conditioning for digital electronics. The series includes both inverting and non-inverting versions, designed to interface reliably between TTL, LS-TTL, and standard CMOS systems while minimizing power consumption. This documentation provides detailed technical specifications, electrical characteristics, pin assignments, and compliance details necessary for engineers building sophisticated circuit designs that require robust signal buffering capability and bus interfacing.
Page 1 Text Content
74H 240 • M 74H 244 In vertin ctal 3-S TA ffer • O ctal 3-S TA ffer
February 1984 Revised May 2005
MM74HCT240 • MM74HCT244 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
The MM74HCT240 is an inverting buffer and the
General Description
MM74HCT244 is a non-inverting buffer. Each device has
The MM74HCT240 and MM74HCT244 3-STATE buffers
two active low enables (1G and 2G), and each enable inde-
utilize advanced silicon-gate CMOS technology and are
pendently controls 4 buffers.
general purpose high speed inverting and non-inverting
All inputs are protected from damage due to static dis-
buffers. They possess high drive current outputs which
charge by diodes to VCC and Ground.
enable high speed operation even when driving large bus capacitances. These circuits achieve speeds comparable
to low power Schottky devices, while retaining the low Features
power consumption of CMOS. All three devices are TTL
■TTL input compatible
input compatible and have a fanout of 15 LS-TTL equiva-
■Typical propagation delay: 14 ns
lent inputs.
■3-STATE outputs for connection to system buses
MM74HCT devices are intended to interface between TTL
and NMOS components and standard CMOS devices. ■Low quiescent current: 80 PA
These parts are also plug-in replacements for LS-TTL ■High output drive current: 6 m A (min) devices and can be used to reduce power consumption in existing designs.
Ordering Code: Order Number Package Number Package Description MM74HCT240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide MM74HCT240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT240N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide MM74HCT244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide MM74HCT244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT244N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View Top View MM74HCT240 MM74HCT244
© 2005 Fairchild Semiconductor Corporation DS005365 www.fairchildsemi.com
Page Summary Contents For Fairchild MM74HCT240 MM74HCT244 Octal 3-State Buffer Data Manual
Manual Details
| Brand | Fairchild |
|---|---|
| Pages | 8 |
| File Size | 108.05 KB |
| Published | July 06, 2026 |
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Frequently Asked Questions
What does the MM74HCT series buffer interface between?
They are designed to interface between TTL, LS-TTL components and standard CMOS devices, and can serve as plug-in replacements for LS-TTL.
Are these buffers suitable for critical life support applications?
No, their use is restricted; they are not authorized for critical components in life support devices without explicit written approval from Fairchild Semiconductor Corporation.
What is the typical performance delay of these circuits?
They have a high-speed operation and achieve speeds comparable to low power Schottky devices, featuring a typical propagation delay of 14 ns.
Which physical package types are available for ordering?
The components are available in several packages, including SOIC (Small Outline), SOP (Small Outline Package), TSSOP (Thin Shrink Small Outline Package), and PDIP (Plastic Dual-In-Line Package).