3M Chip Carrier Sockets - Surface Mount 8400 Series User's Manual and Specifications
Summary
Elevate your electronic assembly reliability with these high-performance Surface Mount Chip Carrier Sockets. Designed for seamless integration of JEDEC-standard chip carriers, this socket supports demanding processes including IR reflow and wave soldering up to 260°C. Featuring an open top, automated loading compatibility, and RoHS compliance, it provides a durable interconnect solution. Ideal for electronics manufacturers and engineers building robust PCB assemblies requiring reliable electrical connectivity.
Page 1 Text Content
3M™ Chip Carrier Sockets Surfacemount 8400 Series
Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular High temperature insulator compatible with IR reflow and wave soldering Compatible with automated loading equipment Open top design allows unrestricted air flow Molded slots for ease of device extraction Available with optional PCB locating posts Ro HS* compliant
Date Modified: December 7, 2006
TS-2147-04 Sheet 1 of 2
Physical
Insulation Material: Glass Filled Polyphenylene Sulfide (PPS) Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 50 µ″, [ 1.27 µm ] Nickel - Overall Wiping Area: 160 µ″, [ 4.06 µm ] Matte Tin
Electrical
Contact Resistance: 15 mΩ Capacitance: 1 p F Insulation Resistance: >103 MΩ minimum
Environmental
Temperature Rating: -40°C to +105°C Process Rating: Maximum 260° C, single pass, (profile per J-STD-020C) Moisture Sensitivity Level: 1 (per J-STD-020C)
*"Ro HS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material, unless the substance is in an application that is exempt under Ro HS: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated in
writing by 3M, this information represents 3M's knowledge and belief based on information provided by third party suppliers to 3M.
3M is a trademark of 3M Company.
Interconnect Solutions For technical, sales or ordering information call http://www.3M.com/interconnects/ 800-225-5373
Page Summary Contents For 3M Chip Carrier Sockets - Surface Mount 8400 Series User's Manual and Specifications
Manual Details
| Brand | Carrier |
|---|---|
| Pages | 3 |
| File Size | 197.47 KB |
| Published | May 17, 2026 |
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Frequently Asked Questions
What chip carrier outlines are compatible with this socket?
It accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular.
What is the electrical contact resistance of the 8400 Series socket?
The Electrical Contact Resistance is rated at 15 mΩ.
What are the limitations regarding high-temperature soldering processes?
It has a Process Rating of a maximum 260° C for single pass, according to J-STD-020C.
Does the socket design accommodate automated handling or device removal?
Yes, it is compatible with automated loading equipment and features molded slots for ease of device extraction.