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3M Test & Burn-In SOIC Sockets User's Manual

Summary

Engineered for rigorous electronic testing and burn-in applications, these high-reliability SOIC sockets feature an actuated lid for secure handling and compatibility with automated load/unload equipment. Designed to maximize board density, they offer gold plating and exceptional temperature resilience across a wide operating range. This manual provides comprehensive technical specifications, including optimal PCB centerlines and clearance dimensions for various configurations (up to 28 positions), making it an essential resource for electrical engineers and test fixture designers requiring precise components.

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Page 1 Text Content

Test & Burn-In SOIC Sockets

• Lid can be actuated from top or front and is compatible with automated load/unload equipment • Compact envelope and side to side stackability maximize board density • Tweezer slot for easy manual loading/unloading • Lid applies 80 grams normal force per lead for maximum electrical reliability • Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths

TS-0338-09

Date Issued: February 19, 2001 Sheet 1 of 4

Physical

Insulation Material: Glass Filled Polyethersulfone Flammability: UL 94V-0 Color: Black Marking: 3M Logo & Part Number Identifier Contact Material: Beryllium-Copper Plating: 30 m" (0.76 mm) Gold over 50 m" (1.3 mm) Nickel

Environmental

Current Rating: 1 Amp Insulation Resistance: > 1 ¥ 1012 W at 500 Vdc Withstanding Voltage: 1000 Vrms at Sea Level

Environmental Operating Temperature Rating: - 55°°C to + 150°C

3M Electronic Handling and Protection Division

For technical, sales or ordering information call 800-328-0411

6801 River Place Blvd.

Austin, TX 78726-9000 or visit our website: http://www.3M.com/ehpd

Page Summary Contents For 3M Test & Burn-In SOIC Sockets User's Manual

Page 1 Test & Burn-In SOIC Sockets • Lid can be actuated from top or front and is compatible with automated load/unload equipment • Compact envelope and side to side stackability maximize board density •...
Page 2 Test & Burn-In SOIC Sockets Part Dimensions um er Tolerance Dimension [ 5.1 ] Standoffs Recommended Spacing .14 .024 x .018 [ 3.8 ] Tolerance [ 0.61 ] x [ 0.46 ] Contact Tail (± .25) (± .13) Cente...
Page 3 Test & Burn-In SOIC Sockets in ge nd in ge nd in ge nd P.C. BOARD PATTERNS 14 Position8 Position PCB Centerline PCB Centerline of Pattern.790 of Pattern Dia. .062 [ 1.57 ] Dia. .062 [ 1.57 ] Socke...
Page 4 Test & Burn-In SOIC Sockets in ge nd 24 Position .920 PCB Centerline of Pattern Dia. .062 [ 1.57 ] Socket (Clearance hole for Outline mounting screw) in ge nd .804 24X Dia. .035 [ 0.89 ] [ 20.42 ]...

Manual Details

Brand 3M
Pages 4
File Size 387.08 KB
Published May 12, 2026
75 views

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Frequently Asked Questions

What device sizes does this socket accept?

It accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths.

Is the unit easy to install and handle manually?

Yes, it features a tweezer slot for easy manual loading/unloading, and its compact design allows side-to-side stackability.

What are the environmental limits for operation?

The operating temperature rating is -55°C to +150°C. It has an insulation resistance of > 1 ¥ 10 W at 500 Vdc.

How does the lid ensure electrical reliability?

The integrated lid applies an 80 grams normal force per lead, which ensures maximum electrical reliability.