ROHM TT8J11 Data Sheet / Manual
Summary
This MOSFET is engineered for power switching applications, featuring low on-resistance and reliable operation with a low 1.5V drive requirement in a compact package. The accompanying technical manual provides comprehensive guidelines for circuit designers, detailing all absolute maximum ratings, electrical characteristics (including switching times and capacitances), and thermal performance data across various temperatures. It is essential reading for electronics engineers selecting robust components for demanding power management systems.
Page 1 Text Content
Data Sheet
1.5V Drive Pch + Pch MOSFET TT8J11
Structure Dimensions (Unit : mm)
Silicon P-channel MOSFET TSST8
Features 1) Low On-resistance. 2) Small high power package. (1) (2) (3) (4)
3) Low voltage drive(1.5V drive).
Abbreviated symbol : J11
Application Switching
Inner circuit
Packaging specifications
Package Taping Type Code TCR (1) Tr1 Source ∗2 ∗2
(2) Tr1 Gate
Basic ordering unit (pieces) (3) Tr2 Source
(4) Tr2 Gate ∗1 ∗1
TT8J11
(5) Tr2 Drain (6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Absolute maximum ratings (Ta = 25C)
Parameter Symbol Limits Unit
Drain-source voltage VDSS 12 Gate-source voltage VGSS 0 to 8
Continuous ID 3.5
Drain current
Pulsed IDP *1 12
Source current Continuous Is 0.8
(Body Diode) Pulsed Isp *1 12 1.25 W / TOTAL PDPower dissipation *2
W / ELEMENT
Channel temperature Tch C Range of storage temperature Tstg 55 to 150 C *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
Thermal resistance
Parameter Symbol Limits Unit
˚C / W /TOTAL
Channel to Ambient Rth (ch-a)
˚C / W /ELEMENT
* Mounted on a ceramic board.
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© 2011 ROHM Co., Ltd. All rights reserved. 1/6 2011.05 - Rev.A
Page Summary Contents For ROHM TT8J11 Data Sheet / Manual
Manual Details
| Brand | ROHM |
|---|---|
| Pages | 7 |
| File Size | 1.19 MB |
| Published | May 27, 2026 |
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Frequently Asked Questions
What is the low-end drive capability?
It features a low voltage drive, specifically 1.5V drive.
What are the power dissipation limits and mounting requirements?
The allowable power dissipation (D) is 1.25 W/TOTAL. It must be mounted on a ceramic board.
How much input capacitance does it have?
The total gate capacitance (Ciss) is listed as 2600 pF at V = -6V and Ids = -3.5A.
Are there specific considerations for operation in electrical environments?
Yes, the manual notes that this product might cause chip aging and breakdown under large electrified environments, requiring an ESD protection circuit design.